Difference between revisions of "Wafer Bonder"

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{{InstrumentInfoboxOneImage|
{{InstrumentInfoboxOneImage|
|InstrumentName = Suss Microtec SB6L Wafer Bonder
|InstrumentName = Wafer Bonder
|HeaderColor = #E6E7E8
|HeaderColor = #E6E7E8
|ImageOne = Wafer-Bonder_Suss-SBL6.jpg
|ImageOne = Wafer-Bonder_Suss-SB6L.jpg
|ImageTwo =  
|ImageTwo =  
|InstrumentType = [[Equipment_List#Support Tools|Support Tools]]
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]],<br>[[Equipment_List#Substrate_Processing|Substrate Processing]]
|RoomLocation =  
|RoomLocation = B217 Steele
|LabPhone = 626-395-1539
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|PrimaryStaff = [[Alex Wertheim]]
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|StaffPhone = 626-395-3371
|StaffPhone = 626-395-3371
|Manufacturer = Suss Microtec
|Manufacturer = Suss Microtec
|Techniques = Pressure/Heat bonding
|Model = SBL6
|Techniques = Pressure/Heat Bonding
|RequestTraining = alexw@caltech.edu
|RequestTraining = alexw@caltech.edu
|EmailList = kni-sb6l
|EmailList = kni-sb6l
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}}
}}
== Description ==
== Description ==
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.  
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.  
===== Applications =====
* MEMS & Microelectronics Fabrication


===== Applications =====
== Resources ==
* MEMS & Microelectronics fabrication
===== SOPs =====
* [https://caltech.box.com/s/jwm9iw0t64s7sznmzwjs32zjdjownts7 KNI SOP]
 
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual]

Latest revision as of 22:06, 28 May 2019

Wafer Bonder
Wafer-Bonder Suss-SB6L.jpg
Instrument Type Support Tools,
Substrate Processing
Techniques Pressure/Heat Bonding
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on LabRunr
Request training by email
Sign up for Wafer Bonder email list
Lab Location B217 Steele
Lab Phone 626-395-1539
Manufacturer Suss Microtec
Model SBL6

Description

The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.

Applications
  • MEMS & Microelectronics Fabrication

Resources

SOPs
Manufacturer Manuals