Difference between revisions of "Wafer Bonder"
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* [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)] | * [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)] | ||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/7pj89gepa98exkv7gyy3hmzs0gv3jo72 Process Manual] | ||
== Specifications == | == Specifications == | ||
===== Notable Specifications ===== | ===== Notable Specifications ===== | ||
* (COMING SOON) | * (COMING SOON) | ||
Revision as of 20:44, 23 May 2019
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Description
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.
Applications
- MEMS & Microelectronics fabrication
Resources
SOPs & Troubleshooting
Manufacturer Manuals
Specifications
Notable Specifications
- (COMING SOON)