Difference between revisions of "Wafer Bonder"

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== Description ==
== Description ==
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.  
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.  
===== Applications =====
===== Applications =====
* MEMS & Microelectronics fabrication
* MEMS & Microelectronics fabrication
== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/BROKEN General SOP & Troubleshooting (COMING SOON)]
===== Manufacturer Manuals =====
* [https://caltech.box.com/s/BROKEN Manual (COMING SOON)]
== Specifications ==
===== Notable Specifications =====
* (COMING SOON)

Revision as of 21:15, 22 May 2019

Suss Microtec SB6L Wafer Bonder
Wafer-Bonder Suss-SB6L.jpg
Instrument Type Support Tools
Techniques Pressure/Heat bonding
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on LabRunr
Request training by email
Sign up for Wafer Bonder email list
Lab Location
Lab Phone 626-395-1539
Manufacturer Suss Microtec
Model SBL6

Description

The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.

Applications
  • MEMS & Microelectronics fabrication

Resources

SOPs & Troubleshooting
Manufacturer Manuals

Specifications

Notable Specifications
  • (COMING SOON)