Difference between revisions of "Wafer Bonder"

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|Techniques = Pressure/Heat bonding
|Techniques = Pressure/Heat bonding
|RequestTraining = alexw@caltech.edu
|RequestTraining = alexw@caltech.edu
|EmailList = kni-sb6lcaltech.edu
|EmailList = kni-sb6l
|EmailListName = kni-sb6l
|EmailListName = Wafer Bonder
== Description ==
== Description ==

Revision as of 00:07, 20 May 2019

Suss Microtec SB6L Wafer Bonder
Instrument Type Support Tools
Techniques Pressure/Heat bonding
Staff Manager Alex Wertheim
Staff Email alexw@caltech.edu
Staff Phone 626-395-3371
Reserve time on LabRunr
Request training by email
Sign up for Wafer Bonder email list
Lab Location
Lab Phone 626-395-1539
Manufacturer Suss Microtec
Model {{{Model}}}


The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp/duration of any process step. Since heat and temperature can be controlled separately, temperature sensitive materials such as polymers may be bonded.

  • MEMS & Microelectronics fabrication