Difference between revisions of "TEM Sample Preparation Equipment"
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===== Videos ===== | ===== Videos ===== | ||
* [https://www.youtube.com/watch?v=NyxfiC13kQ8 Ultrasonic Disk Cutter Model 170 Operation] | * [https://www.youtube.com/watch?v=NyxfiC13kQ8 Ultrasonic Disk Cutter Model 170 Operation] | ||
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== Related Instrumentation in the KNI == | |||
===== Transmission Electron Microscopes ===== | |||
* [[Tecnai TF-30: 300 kV TEM, STEM, EDS & HAADF | Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)]] | |||
* [[Tecnai TF-20: 200 kV TEM, STEM, EDS, EELS, EFTEM & Lithography | Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)]] | |||
===== Sample Preparation for TEM ===== | |||
* [[Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe|Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe]] | |||
* [[TEM Sample Preparation Equipment | TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill]] | |||
===== Sample Preparation for Microscopy ===== | |||
* [[Carbon Evaporator | Carbon Evaporator (Leica EM ACE600) to make samples conductive]] | |||
* [[Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner | Oxygen & Argon Plasma Cleaner (Tergeo Plus ICP- & CCP-RIE) to remove hydrocarbons from surface]] |
Revision as of 22:51, 12 September 2019
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Description
The KNI offers a lab in the Keck sub-basement for preparing TEM samples by traditional means, often to produce cross-section specimens from a bulk sample. This typically involves the following steps:
- Glue together a stack of materials, e.g. with the surface of two samples facing each other
(if the surface is what you want to observe in the TEM) - Cut the stack into thin slices of material, in the appropriate orientation
(the thin dimension here will be the same thin dimension in the TEM) - Cut out a 3 mm circle from this thin slice using a Disk Cutter
- Polish that thin disk down to a thickness of ~100 μm
- Use a Dimpler to polish a hemispherical dimple into the middle of the disk,
such that only a few microns of material remain at the thinnest portion - Use an Argon Mill to perform the final polish of the thinnest portion,
until a hole has been bored through the middle and
the edges of that hole are thin enough to be electron-transparent in the TEM
List of Equipment Available
- Low-Angle Argon Milling & Polishing Station: Fischione Model 1010 (shown in infobox image)
- Dimpler: Fischione Model 2000
- Ultrasonic Disk Cutter: Model 170
- Polishing Station: Allied TechPrep
- Polishing Station: Buehler Ecomet 3
- Low Speed Saw: Isomet
- Roll Grinder: Buehler Handimet 2
- Various polishing media & accessories:
- Media: grit paper, lapping films, polishing cloths, diamond suspensions, alumina poweders
- Accessories: tripod polisher (South Bay Technology), endpoint polisher (Fischione Model 160)
Resources
SOPs
- Paper copies of SOPs are available in the lab for the Argon Ion Mill & Dimpler
Manufacturer Manuals
Videos
Related Instrumentation in the KNI
Transmission Electron Microscopes
- Tecnai TF-30: TEM, STEM, EDS & HAADF (50-300 kV)
- Tecnai TF-20: TEM, STEM, EDS, EELS, EFTEM & Lithography (40-200 kV)
Sample Preparation for TEM
- Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe
- TEM Sample Preparation Equipment: Polishing Stations, 3 mm Disk Cutter, Dimpler, Argon Ion Mill