From the KNI Lab at Caltech
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Lithography
Electron Beam Lithography
Ion Beam Lithography
Optical Lithography
Deposition
Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE
- III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Silicon Etcher
Wet Etching
- Available Wet Chemistry Techniques
Microscopy
Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
- TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
- TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
- Atomic Force Microscope (AFM): Bruker Dimension ICON
- Profilometer: Veeco Dektak 3ST
Optical Characterization
- Spectroscopic Ellipsometry: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics model F40
- Fluorescence Microscope: Olympus IX81
Support Tools
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
- Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
- Wedge-Wedge Wire Bonder: Westbond model 7476D-79
- Electrical Probing Station: Cascade Microtech M150