Difference between revisions of "Equipment List"
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= Deposition = | = Deposition = | ||
===== Evaporation ===== | ===== Evaporation ===== | ||
* Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator | * [[KJL Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]] | ||
* Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator | * [[CHA Industries Mark 40: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]] | ||
* Carbon: Leica EM ACE600 Carbon Evaporator | * [[Leica EM ACE600: Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]] | ||
===== Sputtering ===== | ===== Sputtering ===== | ||
* Dielectric Sputterer: AJA International ATC Orion 8 | * [[ATC Orion 8: Dielectric Sputterer | Dielectric Sputterer: AJA International ATC Orion 8]] | ||
* Chalcogenide Sputterer: AJA International ATC Orion 8 | * [[ATC Orion 8: Chalcogenide Sputterer | Chalcogenide Sputterer: AJA International ATC Orion 8]] | ||
===== Chemical Vapor Deposition (CVD) ===== | ===== Chemical Vapor Deposition (CVD) ===== | ||
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II | * [[Oxford FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]] | ||
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100 | * [[Oxford 100: Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]] | ||
===== Dielectric Packaging / Moisture Barrier ===== | ===== Dielectric Packaging / Moisture Barrier ===== | ||
* Parylene Coater: Para Tech LabTop 3000 | * [[Para Tech LabTop 3000: Parylene Coater | Parylene Coater: Para Tech LabTop 3000]] | ||
= Etching = | = Etching = |
Revision as of 17:00, 23 April 2019
Lithography
Electron Beam Lithography
- Electron Beam Pattern Generator: Raith EBPG 5200 (100 kV)
- Electron Beam Pattern Generator: Raith EBPG 5000+ (100 kV)
- Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 kV)
- Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 kV)
Ion Beam Lithography
Optical Lithography
- Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
- i-Line Wafer Stepper: GCA model 6300
- Direct-Write Laser System: Heidelberg Instruments DWL-66
- Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT
Deposition
Evaporation
- Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
- Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
- Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
- Dielectric Sputterer: AJA International ATC Orion 8
- Chalcogenide Sputterer: AJA International ATC Orion 8
Chemical Vapor Deposition (CVD)
- Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
- Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
Etching
Dry Etching
- Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE
- III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE
- Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE
- Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
- Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
- XeF2 Silicon Etcher
Wet Etching
- Available Wet Chemistry Techniques
Microscopy
Focused Ion Beam (FIB) Systems
- He/Ne/Ga-FIB: Zeiss ORION NanoFab
- Ga-FIB/SEM/Omniprobe: Thermo Fisher Nova 600 NanoLab
Scanning Electron Microscopes (SEMs)
- SEM/EDS/WDS: Thermo Fisher Nova 200 NanoLab
- SEM/EDS: Thermo Fisher Sirion
- SEM/ESEM: Thermo Fisher Quanta 200F
- SEM/Ga-FIB/Omniprobe: Thermo Fisher Nova 600 NanoLab
Transmission Electron Microscopes (TEMs)
- TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
- TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
- Atomic Force Microscope (AFM): Bruker Dimension ICON
- Profilometer: Veeco Dektak 3ST
Optical Characterization
- Spectroscopic Ellipsometry: Woolam M-2000
- Light Microscope: Olympus BX51M with Filmetrics model F40
- Fluorescence Microscope: Olympus IX81
Support Tools
Thermal Processing
- Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
- Rapid Thermal Processing: Modular Process Technology RTP-600S
- Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
- Scriber-Breaker: Dynatex GST-150
- Wafer Bonder: Suss MicroTec model SB6L
- Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
- Wedge-Wedge Wire Bonder: Westbond model 7476D-79
- Electrical Probing Station: Cascade Microtech M150