Difference between revisions of "Equipment List"

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= Deposition =
 
= Deposition =
 
===== Evaporation =====
 
===== Evaporation =====
* Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
+
* [[KJL Labline: Electron Beam Evaporator | Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator]]
* Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
+
* [[CHA Industries Mark 40: Electron Beam Evaporator | Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator]]
* Carbon: Leica EM ACE600 Carbon Evaporator
+
* [[Leica EM ACE600: Carbon Evaporator | Carbon: Leica EM ACE600 Carbon Evaporator]]
  
 
===== Sputtering =====
 
===== Sputtering =====
* Dielectric Sputterer: AJA International ATC Orion 8
+
* [[ATC Orion 8: Dielectric Sputterer | Dielectric Sputterer: AJA International ATC Orion 8]]
* Chalcogenide Sputterer: AJA International ATC Orion 8
+
* [[ATC Orion 8: Chalcogenide Sputterer | Chalcogenide Sputterer: AJA International ATC Orion 8]]
  
 
===== Chemical Vapor Deposition (CVD) =====
 
===== Chemical Vapor Deposition (CVD) =====
* Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
+
* [[Oxford FlexAL II: Atomic Layer Deposition (ALD) | Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II]]
* Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
+
* [[Oxford 100: Plasma-Enhanced Chemical Vapor Deposition (PECVD) | Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100]]
 +
 
 
===== Dielectric Packaging / Moisture Barrier =====
 
===== Dielectric Packaging / Moisture Barrier =====
* Parylene Coater: Para Tech LabTop 3000
+
* [[Para Tech LabTop 3000: Parylene Coater | Parylene Coater: Para Tech LabTop 3000]]
  
 
= Etching =
 
= Etching =

Revision as of 17:00, 23 April 2019

Lithography

Electron Beam Lithography
Ion Beam Lithography
Optical Lithography

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)
Dielectric Packaging / Moisture Barrier

Etching

Dry Etching
  • Silicon Etcher: Oxford Instruments DRIE System 100 Bosch & Cryo ICP–RIE
  • III/V Material, Metal & Silicon Etcher: Oxford Instruments System 100 ICP–RIE
  • Dielectric Material Etcher: Oxford Instruments Dielectric System 100 ICP–RIE
  • Silicon, III/V Material & Organics Etcher: Plasmatherm Dual Chamber RIE
  • Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
  • XeF2 Silicon Etcher
Wet Etching
  • Available Wet Chemistry Techniques

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
  • TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-300 kV)
  • TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-200 kV)
Scanning Probe Microscopes
  • Atomic Force Microscope (AFM): Bruker Dimension ICON
  • Profilometer: Veeco Dektak 3ST
Optical Characterization
  • Spectroscopic Ellipsometry: Woolam M-2000
  • Light Microscope: Olympus BX51M with Filmetrics model F40
  • Fluorescence Microscope: Olympus IX81

Support Tools

Thermal Processing
  • Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
  • Rapid Thermal Processing: Modular Process Technology RTP-600S
  • Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
  • Scriber-Breaker: Dynatex GST-150
  • Wafer Bonder: Suss MicroTec model SB6L
  • Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
  • Wedge-Wedge Wire Bonder: Westbond model 7476D-79
  • Electrical Probing Station: Cascade Microtech M150