Difference between revisions of "DWL-66: Direct-Write Laser System"
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===== SOPs ===== | ===== SOPs ===== | ||
* [https://caltech.box.com/s/y86tagq2ajxt16wnj5bmqwupas1f1bs7 Operation SOP] | * [https://caltech.box.com/s/y86tagq2ajxt16wnj5bmqwupas1f1bs7 Operation SOP] | ||
===== Optical Lithography Resources ===== | |||
* [[Optical Lithography Resources | Optical Lithography Resources Page]] | |||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== |
Revision as of 01:25, 8 November 2019
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Description
The Heidelberg Instruments DWL-66 is a tool for mask making and for direct patterning of wafers by the use of a HeCd laser. Precise control of the laser head and alignment produces 800-nm resolution lithography. The DWL 66 is an extremely high-resolution imaging system where over half a million dpi (dots per inch) is achieved using a 40-nm writeable address grid for exposing chrome plates or wafers.
Applications
- Direct Writing
- Grayscale Writing
Resources
SOPs
Optical Lithography Resources
Manufacturer Manuals
Specifications
- Exposure: 442 nm wavelength HeCd laser