DWL-66: Direct-Write Laser System: Difference between revisions

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== Resources ==
== Resources ==
===== SOPs =====
===== SOPs =====
* [https://caltech.box.com/s/miia23ob94wsdomfb2bi00d4cfhdeuao Operation SOP]
* [https://caltech.box.com/s/y86tagq2ajxt16wnj5bmqwupas1f1bs7 Operation SOP]

===== Manufacturer Manuals =====
===== Manufacturer Manuals =====

Revision as of 21:46, 28 May 2019

DWL-66 Direct-Write Laser System
Instrument Type Lithography
Techniques Direct Patterning,
Pattern Alignment,
Wafer and Mask Patterning
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Lab Location B217 Steele
Lab Phone 626-395-1536
Manufacturer Heidelberg Instruments
Model DWL-66


The Heidelberg Instruments DWL-66 is a tool for mask making and for direct patterning of wafers by the use of a HeCd laser. Precise control of the laser head and alignment produces 800-nm resolution lithography. The DWL 66 is an extremely high-resolution imaging system where over half a million dpi (dots per inch) is achieved using a 40-nm writeable address grid for exposing chrome plates or wafers.

  • Direct Writing
  • Grayscale Writing


Manufacturer Manuals


  • Exposure: 442 nm wavelength HeCd laser