For non-conductive specimens that cannot be effectively SEM- or FIB-imaged with some combination of low voltage, low current, zero detector bias, and scanning filters, depositing a thin conductive layer of carbon on the surface can improve imaging. This carbon evaporator produces high-quality amorphous films with thicknesses ranging from sub-nm to 10 nm, with a morphology that is generally undetectable in electron microscopes. After imaging, the carbon layer can be gently removed using an O2 plasma, for example, with the lab's Tergeo Plus Plasma Cleaner. The system is also equipped with a metal sputtering capability (e.g., Au), which produces a fine-grained metallic layer and expands its range of applications.
Applications
Coat a material surface to make a sample conductive for SEM or FIB imaging.
Coat resist surface to make a ample conductive for e-beam lithography.
Apply carbon to a specimen or device for other fabrication purposes.
Possible Target Materials & Deposition Methods
Carbon — via evaporation
Metal (e.g., Au, Pt, Cr, W) — via sputtering
Resources
Equipment Data
The Carbon Evaporator source needs to be periodically disconnected from the instrument by the user so that the carbon thread can be changed; see the SOP and notes in the SOP section on this page for instructions on how to change the thread.
The procedure to install a new carbon thread can be found on Manual page 47
Note: always install as a "double thread," i.e. double the thread back over itself before installing – a thread length that is approximately twice the length of the evaporator's door width is long enough to double over and install.
