Tube Furnaces for Wet & Dry Processing: Difference between revisions
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m (Removed link to Equipment Status under Resources since the status can be viewed directly by users in FBS, per Tiffany 4/15/24 sg) |
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* Water Vapor (Tube 1) | * Water Vapor (Tube 1) | ||
== Resources == | == Resources == | ||
===== Tystar Oxidation Recipe ===== | ===== Tystar Oxidation Recipe ===== |
Latest revision as of 22:59, 15 April 2024
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Description
The system is designed for processing up to one-hundred, 150 mm (6") silicon or sapphire wafers per tube and can accommodate smaller sample sizes also. Tube 1 is designated for wet & dry oxidation using a flask evaporator. Tube 2 is designated for dry oxidation and annealing.
Applications
- Dry & Wet oxidation
- Annealing
Allowed Materials
- Silicon, SiNx, or sapphire that is completely free of metal or organic contamination
- Recommended to have undergone a standard RCA clean or similar beforehand
- No other sample material allowed
- No metal or organic contamination
- Wafers must not have been contacted by metal tweezers, etc. without appropriate cleaning to remove metal contamination
Gas List
- Nitrogen
- Oxygen
- Water Vapor (Tube 1)