Wafer Bonder

Wafer Bonder Instrument Type Support Tools, Substrate Processing Techniques Pressure/Heat Bonding Staff Manager Nathan S. Lee Staff Email nathslee@caltech.edu Staff Phone 626-395-4386 Reserve time on FBS Request training via FBS User Dashboard Lab Location B217 Steele Lab Phone 626-395-4075 Manufacturer Suss Microtec Model SBL6

Description

The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.

Applications

• MEMS & Microelectronics Fabrication

Resources

SOPs

• KNI SB6L SOP - Operating Instructions for the Suss SB6L Wafer Bonder

Manufacturer Manuals

• SB6L User Manual - The SUSS SB6L Wafer Bonder System User Manual
• NP12 User Manual - The SUSS NP 12™ Plasma Activation System User Manual
• Suss Micro Tec Process Manual -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.