Wedge-Wedge Wire Bonder: Difference between revisions
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|RoomLocation = B233 Steele | |RoomLocation = B233 Steele | ||
|LabPhone = 626-395-5429 | |LabPhone = 626-395-5429 | ||
|PrimaryStaff = [[ | |PrimaryStaff = [[Nathan Lee]] | ||
|StaffEmail = | |StaffEmail = nathslee@caltech.edu | ||
|StaffPhone = 626-395-4075 | |StaffPhone = 626-395-4075 | ||
|Manufacturer = WestBond | |Manufacturer = WestBond | ||
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* [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 WestBond 7476D Wire Bonder Manual] | * [https://caltech.box.com/s/rq3faoi1t59qf03l4j7bkwb8oewndsi3 WestBond 7476D Wire Bonder Manual] | ||
* [https://caltech.box.com/s/7yfera0l0q9hpc5i4rcmameuu6h3yszs WestBond K1200D Temperature Controller Manual] | * [https://caltech.box.com/s/7yfera0l0q9hpc5i4rcmameuu6h3yszs WestBond K1200D Temperature Controller Manual] | ||
===== | ===== FBS Reservation Rules:===== | ||
{| class="wikitable" | {| class="wikitable" | ||
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Latest revision as of 17:53, 18 February 2025
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Description
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.
Applications
- Bonding aluminum wire to a metal bond pads.
- Aluminum wire thickness currently being used is 0.001 inch.
Resources
SOPs & Troubleshooting
- WestBond - General SOP
- WestBond - Tool Change SOP
- WestBond - Changing the wire spool-This presentation also give guidance on THREADING THE WIRE.
Manufacturer Manuals
FBS Reservation Rules:
| Advanced Res (days) | Limit per Res (hrs) | Limit per week (hrs) | |
|---|---|---|---|
| Weekday | 7 | 4 | 12 |
| Weeknight | 7 | 6 | 18 |
| Weekend | 14 | 6 | 18 |
For reservations that DO NOT follow the reservation policy, email the tool manager BEFORE scheduling. Your reservation can be cancelled at any time by the tool manager if it does not follow the tool reservation policy.
Specifications
Manufacturer Specifications
- See - WestBond 7476D Wire Bonder Manual
- Recommended Bond Pad Requirements:
- 1. Minimum Pad Size - 60um wide by 90um tall with 50um spacing between pads.
- Bonding will be difficult and little room for error.
- 2. Suggested Pad Size - 120um wide by 120um tall with 50um spacing between pads (larger is better).
- 3. Minimum Pad Thickness - 150nm Gold (thicker is better).
- 4. Suggested Pad Thickness - 250nm Gold.
- 1. Minimum Pad Size - 60um wide by 90um tall with 50um spacing between pads.