CHA: Electron Beam Evaporator: Difference between revisions
		
		
		
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|  (Created page with "{{InstrumentInfobox| |InstrumentName = CHA Mk40 Evaporator |HeaderColor = #F2682A |ImageOne = Research-Image.jpg |ImageTwo = Instrument-Image.jpg |InstrumentType = Equipment...") | No edit summary | ||
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| {{ | {{InstrumentInfoboxOneImage| | ||
| |InstrumentName = CHA  | |InstrumentName = CHA Evaporator | ||
| |HeaderColor = #F2682A | |HeaderColor = #F2682A | ||
| |ImageOne =  | |ImageOne = CHA-Industries-Mark-40_E-Beam-Evaporator.jpg | ||
| |ImageTwo =  | |ImageTwo =   | ||
| |InstrumentType = [[Equipment_List#Deposition|Deposition]] | |InstrumentType = [[Equipment_List#Deposition|Deposition]] | ||
| |RoomLocation = B123 Steele | |RoomLocation = B123 Steele | ||
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| |StaffPhone = 626-395-3371 | |StaffPhone = 626-395-3371 | ||
| |Manufacturer = CHA Industries | |Manufacturer = CHA Industries | ||
| |Techniques = E-beam  | |Model = Mark 40 | ||
| |Techniques = E-beam Evaporation | |||
| |EmailList = cha-labline@caltech.edu | |EmailList = cha-labline@caltech.edu | ||
| |EmailListName =  E-beam Evaporator | |EmailListName =  E-beam Evaporator | ||
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| ===== Applications ===== | ===== Applications ===== | ||
| * Metal & Oxide  | * Metal & Oxide Deposition  | ||
| * Lift-off | * Lift-off | ||
| * Etch  | * Etch Hard-mask Formation  | ||
| == Resources == | == Resources == | ||
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| ===== Hardware Specifications ===== | ===== Hardware Specifications ===== | ||
| * Typical base pressure: 1E-6 to 1E-7 Torr | * Typical base pressure: 1E-6 to 1E-7 Torr | ||
| * All dry pumping system (cryo  | * All dry pumping system (cryo & dry mechanical pump) | ||
| * Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source | * Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source | ||
Revision as of 19:56, 27 May 2019
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Description
The CHA Mark 40 electron beam evaporator is a cryopumped six-pocket electron beam deposition system that is optimized for processing multiple wafers with a planetary substrate holder configuration. This tool offers precise control of electron beam evaporation processes for metal films.
Applications
- Metal & Oxide Deposition
- Lift-off
- Etch Hard-mask Formation
Resources
SOPs & Troubleshooting
Video Tutorials
Specifications
Hardware Specifications
- Typical base pressure: 1E-6 to 1E-7 Torr
- All dry pumping system (cryo & dry mechanical pump)
- Evaporation Source: 1x single emitter, 6-pocket e-beam evaporation source
