View source for XeF2 Etcher for Silicon

{{InstrumentInfoboxOneImage|
|InstrumentName = XeF<sub>2</sub> Silicon Etcher 
|HeaderColor = #FFE2B9
|ImageOne = XeF2-Etcher.jpg
|ImageTwo = 
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alireza Ghaffari]]
|StaffEmail = alireza@caltech.edu
|StaffPhone = 626-395-3984
|Manufacturer = N/A
|Model = N/A
|Techniques = Selective dry Si etching
|RequestTraining = alireza@caltech.edu
|EmailList = kni-XeF2
|EmailListName = XeF<sub>2</sub>
}}
== Description ==
The XeF<sub>2</sub> etcher flows pressure- and time-controlled pulses of XeF<sub>2</sub> gas into a chamber to deliver an isotropic etch that is highly selective only to silicon. It is commonly used to remove Si under layers that are accessed through vias, in order to suspend membranes and other structures in MEMS devices. 

===== Applications =====
* Very high selectivity dry Si etching
* MEMS fabrication

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select XeF2 from the dropdown menu)

===== SOPs =====
* [https://caltech.box.com/s/2zf5dwmdjyjxptvoscxkxe6yt57vr85v KNI SOP]