Wet Chemistry

Wet Chemistry Instrument Type Wet Chemistry Techniques Wet Chemical Processing: Acids, Bases, Solvents, and Electroplating Staff Manager Bert Mendoza Staff Email bertm@caltech.edu Staff Phone 626-395-4075 Reserve time on LabRunr Request training by email Lab Location B211 Steele Lab Phone 626-395-1538 Manufacturer NA Model NA

Facilities and Chemicals

Available Benches

• Acids
• Hydrofluoric Acid (HF)
• Bases
• Potassium Hydroxide (KOH)
• Solvents
• Electroplating

Chemicals Provided by the KNI with typical SDS

• Acetic Acid Glacial
• Acetone
• Aluminum Etchant Type A
• Aluminum Etchant D
• Ammonium Hydroxide (NH₄OH)
• Au Etchant
• AZ 400K Photoresist Developer
• AZ 726 MIF Developer
• AZ 4620
• AZ 5214-E Photoresist
• Buffered HF Improved
• CD 26 Developer
• Chromium Etchant CR-7S
• Citric Acid
• Copper Etchant
• Hexamethyldisilizane (HMDS)
• Hydrochloric Acid
• Hydrofluoric Acid (HF)
• Hydrogen Peroxide, 30% H₂O₂
• Isopropyl Alcohol (IPA)
• Methanol
• Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)
• Methylene Chlorine (Dichloromethane)
• MF 319 Developer
• Nano-strip and Nanostrip 2x
• Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)
• PGMEA
• Phosphoric Acid (H₃PO₄)
• Potassium Hydroxide
• SU-8 Developer (Micro-Chem)
• Sulfuric Acid (H₂SO₄)
• Titanium Etchant TFT
• Tetramethylammonium Hydroxide 25% (TMAH)

Approved Chemicals

• See List

Resources

Safety Data Sheets (SDS)

• See all SDS