Wedge-Wedge Wire Bonder

Wire Bonder Instrument Type Support Tools, Device Processing Techniques Wire Bonding Staff Manager Bert Mendoza Staff Email bertm@caltech.edu Staff Phone 626-395-4075 Reserve time on LabRunr Request training by email Lab Location B233 Steele Lab Phone 626-395-5429 Manufacturer WestBond Model 7476D-79

Description

Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.

Applications

• Bonding aluminum wire to a metal bond pad
• Bonding gold wire to a metal bond pad

Resources

SOPs & Troubleshooting

• General SOP & Troubleshooting (COMING SOON)

Manufacturer Manuals

• Manual

Specifications

Manufacturer Specifications

• See Manual