Wedge-Wedge Wire Bonder

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WestBond 7476D-79 Wire Bonder
Suss-test.jpg
Instrument Type Device Processing
Techniques Wire Bonding
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Sign up for Photolithography email list
Lab Location B233 Steele
Lab Phone 626-395-5429
Manufacturer WestBond
Model {{{Model}}}

Description

Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.002 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in a device fabrication process.

Type1 Applications
  • Application1
  • Application2
  • Application3

Resources

SOPs & Troubleshooting
Manufacturer Manuals

Specifications

Manufacturer Specifications
Mode 1 Specifications
  • Voltage Range: 0.5 to 30.0 kV
  • Aperture Sizes: 10 mm, 15 mm, 20 mmm, 30 mm
  • etc.
Mode 2 Specifications
  • Voltage Range: 5.0 to 30.0 kV
  • Current Range: 10 pA - 20 nA
  • etc.