Difference between revisions of "Wedge-Wedge Wire Bonder"
Jump to navigation
Jump to search
m |
|||
| Line 18: | Line 18: | ||
== Description == | == Description == | ||
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process. | Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process. | ||
===== | ===== Applications ===== | ||
* Bonding aluminum wire | * Bonding aluminum wire to a metal bond pad | ||
* Bonding gold wire | * Bonding gold wire to a metal bond pad | ||
== Resources == | == Resources == | ||
Revision as of 16:19, 23 December 2019
|
Description
Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.
Applications
- Bonding aluminum wire to a metal bond pad
- Bonding gold wire to a metal bond pad