Wedge-Wedge Wire Bonder: Difference between revisions

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|ImageOne = Wedge-Wedge-Wire-Bonder_Westbond-7476D-79.jpg
|ImageOne = Wedge-Wedge-Wire-Bonder_Westbond-7476D-79.jpg
|ImageTwo =  
|ImageTwo =  
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]],<br>[[Equipment_List#Device|Device Processing]]
|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]],<br>[[Equipment_List#Device_Processing|Device Processing]]
|RoomLocation = B233 Steele
|RoomLocation = B233 Steele
|LabPhone = 626-395-5429
|LabPhone = 626-395-5429

Revision as of 22:05, 27 May 2019

Wire Bonder
Wedge-Wedge-Wire-Bonder Westbond-7476D-79.jpg
Instrument Type Support Tools,
Device Processing
Techniques Wire Bonding
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Lab Location B233 Steele
Lab Phone 626-395-5429
Manufacturer WestBond
Model 7476D-79

Description

Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.0020 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in the device fabrication process.

Type1 Applications
  • Bonding aluminum wire
  • Bonding gold wire

Resources

SOPs & Troubleshooting
Manufacturer Manuals

Specifications

Manufacturer Specifications