Difference between revisions of "Wedge-Wedge Wire Bonder"

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|InstrumentName = Wire Bonder
|InstrumentName = Wire Bonder
|HeaderColor = #E6E7E8
|HeaderColor = #E6E7E8
|ImageOne =  
|ImageOne = Wedge-Wedge-Wire-Bonder_Westbond-7476D-79.jpg
|ImageTwo =  
|ImageTwo =  
|InstrumentType = [[Equipment_List#Support tools|Device Processing]]
|InstrumentType = [[Equipment_List#Support tools|Device Processing]]

Revision as of 07:15, 21 May 2019

Wire Bonder
Wedge-Wedge-Wire-Bonder Westbond-7476D-79.jpg
Instrument Type Device Processing
Techniques Wire Bonding
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Sign up for Photolithography email list
Lab Location B233 Steele
Lab Phone 626-395-5429
Manufacturer WestBond
Model 7476D-79


Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.002 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in a device fabrication process.

Type1 Applications
  • Application1
  • Application2
  • Application3


SOPs & Troubleshooting
Manufacturer Manuals


Manufacturer Specifications
Mode 1 Specifications
  • Voltage Range: 0.5 to 30.0 kV
  • Aperture Sizes: 10 mm, 15 mm, 20 mmm, 30 mm
  • etc.