Wedge-Wedge Wire Bonder

Wire Bonder [[image:|320x373px|center|]] Instrument Type Device Processing Techniques Wire Bonding Staff Manager Bert Mendoza Staff Email bertm@caltech.edu Staff Phone 626-395-4075 Reserve time on LabRunr Request training by email Lab Location B233 Steele Lab Phone 626-395-5429 Manufacturer WestBond Model 7476D-79

Description

Machines of this series bond aluminum or gold wires, ranging from 0.0007 to 0.002 inches in diameter, by the wedge-wedge technique. Ultrasonic energy is used to attach aluminum wire at room temperature, while adding work piece heat is used for attaching gold wire. Wire-bonding is often one of the last steps in a device fabrication process.

Type1 Applications

• Application1
• Application2
• Application3

Resources

SOPs & Troubleshooting

• SOP Type (Short Version | Long Version)
• GCA 6300 Power-up SOP
• Troubleshooting Guide

Manufacturer Manuals

• Manual

Specifications

Manufacturer Specifications

• Manufacturuer Data Sheet

Mode 1 Specifications

• Voltage Range: 0.5 to 30.0 kV
• Aperture Sizes: 10 mm, 15 mm, 20 mmm, 30 mm
• etc.