Scriber-Breaker

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Scriber-Breaker
Dynatex-GST-150 Scriber-Breaker.jpg
Instrument Type Substrate Processing
Techniques Wafer & Chip Scribing,
Scribe Breaking
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Sign up for Scriber email list
Lab Location B213 Steele
Lab Phone 626-395-1537
Manufacturer Dynatex
Model GST-150

Description

The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and dicing difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe/break technology is successful for such materials.

Applications
  • Scribing and/or breaking wafers

Resources

SOPs & Troubleshooting
Manufacturer Manuals

Specifications

Notable Specifications
  • Accommodated Sizes: up to 6" wafers
  • Materials excluded from scribing: COMING SOON