Difference between revisions of "Scriber-Breaker"
Jump to navigation
Jump to search
| Line 1: | Line 1: | ||
{{InstrumentInfoboxOneImage| | {{InstrumentInfoboxOneImage| | ||
|InstrumentName = Scriber-Breaker | |InstrumentName = Scriber-Breaker | ||
|HeaderColor = # | |HeaderColor = #E6E7E8 | ||
|ImageOne = Dynatex-GST-150_Scriber-Breaker.jpg | |ImageOne = Dynatex-GST-150_Scriber-Breaker.jpg | ||
|ImageTwo = | |ImageTwo = | ||
|InstrumentType = [[Equipment_List#Support | |InstrumentType = [[Equipment_List#Support_Tools|Support Tools]],<br>[[Equipment_List#Substrate_Processing|Substrate Processing]] | ||
|RoomLocation = B213 Steele | |RoomLocation = B213 Steele | ||
|LabPhone = 626-395-1537 | |LabPhone = 626-395-1537 | ||
| Line 17: | Line 17: | ||
}} | }} | ||
== Description == | == Description == | ||
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and dicing difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe | The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials. | ||
===== Applications ===== | ===== Applications ===== | ||
* Scribing and/or breaking wafers | * Scribing and/or breaking wafers | ||
Revision as of 22:00, 27 May 2019
|
Description
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.
Applications
- Scribing and/or breaking wafers
Resources
SOPs & Troubleshooting
Manufacturer Manuals
Specifications
Notable Specifications
- Accommodated Sizes: up to 6" wafers
- Materials excluded from scribing: COMING SOON