Provided Chemicals

Chemicals Provided by the KNI with typical SDS

• Acetic Acid Glacial
• Acetone
• Aluminum Etchant Type A
• Aluminum Etchant Type D
• Ammonium Hydroxide (NH₄OH)
• AZ 400K Photoresist Developer
• AZ 726 MIF Developer
• AZ 4620
• AZ 5214-E Photoresist
• Buffered HF Improved
• CD 26 Developer
• Chromium Etchant CR-7S
• Citric Acid
• Copper Etchant APS-100
• Gold Etchant TFA
• Hexamethyldisilizane (HMDS)
• Hydrochloric Acid
• [https://caltech.box.com/s/fl0p67vj2gtucz6896taed5wu9thdoeo Hydrofluoric Acid Improved (BHF)
• Hydrogen Peroxide, 30% H₂O₂
• Isopropyl Alcohol (IPA)
• Methanol
• Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)
• Methylene Chlorine (Dichloromethane)
• MF 319 Developer
• Nano-strip and Nanostrip 2x
• Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)
• PGMEA
• Phosphoric Acid (H₃PO₄)
• Potassium Hydroxide
• S1813 Photoresist
• SU-8 Developer (Micro-Chem)
• Sulfuric Acid (H₂SO₄)
• Titanium Etchant TFT
• Titanium Etchant TFTN
• Tetramethylammonium Hydroxide 25% (TMAH)

All Approved Chemicals

• See List