Provided Chemicals: Difference between revisions
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===== Chemicals Provided by the KNI with typical SDS===== | ===== Chemicals Provided by the KNI with typical SDS===== | ||
* [https://caltech.box.com/s/ | * [https://caltech.box.com/s/vi41cjm27b45uqjfiusl3vh87y8v5de4 Acetic Acid Glacial] | ||
* [https://caltech.box.com/s/3zz1ugq1qgtwmc29o54313sy8u7an9hd Acetone] | * [https://caltech.box.com/s/3zz1ugq1qgtwmc29o54313sy8u7an9hd Acetone] | ||
* [https://caltech.box.com/s/a8n0s5au2cucnsfqlwh2wctml3imigwb Aluminum Etchant Type A] | * [https://caltech.box.com/s/a8n0s5au2cucnsfqlwh2wctml3imigwb Aluminum Etchant Type A] | ||
Revision as of 20:33, 21 July 2022
Chemicals Provided by the KNI with typical SDS
- Acetic Acid Glacial
- Acetone
- Aluminum Etchant Type A
- Aluminum Etchant Type D
- Ammonium Hydroxide (NH4OH)
- AZ 400K Photoresist Developer
- AZ 726 MIF Developer
- AZ 4620
- AZ 5214-E Photoresist
- Buffered HF Improved
- CD 26 Developer
- Chromium Etchant CR-7S
- Citric Acid
- Copper Etchant APS-100
- Gold Etchant TFA
- Hexamethyldisilizane (HMDS)
- Hydrochloric Acid
- Hydrofluoric Acid (HF)
- Hydrogen Peroxide, 30% H2O2
- Isopropyl Alcohol (IPA)
- Methanol
- Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)
- Methylene Chlorine (Dichloromethane)
- MF 319 Developer
- Nano-strip and Nanostrip 2x
- Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)
- PGMEA
- Phosphoric Acid (H3PO4)
- Potassium Hydroxide
- S1813 Photoresist
- SU-8 Developer (Micro-Chem)
- Sulfuric Acid (H2SO4)
- Titanium Etchant TFT
- Titanium Etchant TFTN
- Tetramethylammonium Hydroxide 25% (TMAH)