Provided Chemicals: Difference between revisions
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* [https://caltech.box.com/s/tf1ty82wcbf68l7gekqsna3ajuiljhkw Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)] | * [https://caltech.box.com/s/tf1ty82wcbf68l7gekqsna3ajuiljhkw Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)] | ||
* [https://caltech.box.com/s/w1fp48vpymlru0675o28tuugig7bmevv MF 319 Developer] | * [https://caltech.box.com/s/w1fp48vpymlru0675o28tuugig7bmevv MF 319 Developer] | ||
* [https://caltech.box.com/s/mewj3293pbgyjj3zxupoj0uo9i4hv0c7 | * [https://caltech.box.com/s/mewj3293pbgyjj3zxupoj0uo9i4hv0c7 Nanostrip] | ||
* [https://caltech.box.com/s/kqdon6279rxtna894s6qzgah7xn3p0ld Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)] | * [https://caltech.box.com/s/kqdon6279rxtna894s6qzgah7xn3p0ld Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)] | ||
* [https://caltech.box.com/s/cmq0uvsm78jj0hxzp2q5bozdhrttz5sx PGMEA (Propylene glycol monomethyl ether acetate)] | * [https://caltech.box.com/s/cmq0uvsm78jj0hxzp2q5bozdhrttz5sx PGMEA (Propylene glycol monomethyl ether acetate)] | ||
* [https://caltech.box.com/s/44slar2g3q5cbe9vrpg5tq7viwq1v6vm Phosphoric Acid (H<sub>3</sub>PO<sub>4</sub>)] | * [https://caltech.box.com/s/44slar2g3q5cbe9vrpg5tq7viwq1v6vm Phosphoric Acid (H<sub>3</sub>PO<sub>4</sub>)] | ||
* [https://caltech.box.com/s/41wp3geih92ydmu1jrv5f4spms6j1utg Potassium Hydroxide] | * [https://caltech.box.com/s/41wp3geih92ydmu1jrv5f4spms6j1utg Potassium Hydroxide] | ||
* [https://caltech.box.com/s/clxx77yqllfxz7us1tmih29v3vhiyvnl S1805 Photoresist] | |||
* [https://caltech.box.com/s/osts75gximolfc9o5sag2u1xwzyfrzpy S1813 Photoresist] | * [https://caltech.box.com/s/osts75gximolfc9o5sag2u1xwzyfrzpy S1813 Photoresist] | ||
* [https://caltech.box.com/s/698pk3xjr6feh9wv9q8gojeyyp9ogpl7 S1818 Photoresist] | |||
* [https://caltech.box.com/s/avqs14mt28i1epom0n6w37p55rjqvkbe SU-8 Developer] | * [https://caltech.box.com/s/avqs14mt28i1epom0n6w37p55rjqvkbe SU-8 Developer] | ||
* [https://caltech.box.com/s/89j0lgduzv1hqnewgfr5rrkigxcpw5b3 Sulfuric Acid (H<sub>2</sub>SO<sub>4</sub>)] | * [https://caltech.box.com/s/89j0lgduzv1hqnewgfr5rrkigxcpw5b3 Sulfuric Acid (H<sub>2</sub>SO<sub>4</sub>)] | ||
Revision as of 16:59, 28 July 2022
Chemicals Provided by the KNI with typical SDS
- 495 PMMA Series Resists in Anisole
- 495 PMMA Series Resists in Chlorobenzene
- 950 PMMA Series Resists in Anisole
- 950 PMMA Series Resists in Chlorobenzene
- Acetic Acid Glacial
- Acetone
- Aluminum Etchant Type A
- Aluminum Etchant Type D
- Ammonium Hydroxide (NH4OH)
- AZ 3330-F Photoresist
- AZ 400K Developer
- AZ 5214-E Photoresist
- AZ 726 MIF Developer
- AZ 9245 Photoresist
- AZ 9260 Photoresist
- AZ NLOF 2020 Photoresist
- AZ NLOF 2035 Photoresist
- AZ NLOF 2070 Photoresist
- AZ P4620 Photoresist
- CD 26 Developer
- Chromium Etchant CR-7S
- Citric Acid
- Copper Etchant APS-100
- Dichloromethane (Methylene Chlorine)
- Gold Etchant TFA
- Hexamethyldisilizane (HMDS)
- Hydrochloric Acid
- Hydrofluoric Acid Improved (BHF)
- Hydrogen Peroxide, 30% H2O2
- Isopropyl Alcohol (IPA)
- Methanol (Methyl alcohol)
- Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)
- MF 319 Developer
- Nanostrip
- Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)
- PGMEA (Propylene glycol monomethyl ether acetate)
- Phosphoric Acid (H3PO4)
- Potassium Hydroxide
- S1805 Photoresist
- S1813 Photoresist
- S1818 Photoresist
- SU-8 Developer
- Sulfuric Acid (H2SO4)
- Titanium Etchant TFT
- Titanium Etchant TFTN
- Tetramethylammonium Hydroxide 25% (TMAH)