Provided Chemicals: Difference between revisions
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===== Chemicals Provided by the KNI with typical SDS===== | ===== Chemicals Provided by the KNI with typical SDS===== | ||
* [https://caltech.box.com/s/41v6o6ewk4sp7zk9jwi1j6qizanourm5 495 PMMA Series Resists in Anisole] | |||
* [https://caltech.box.com/s/dje0cyngzsw0s9bh94gfttaf196wlfkg 495 PMMA Series Resists in Chlorobenzene] | |||
* [https://caltech.box.com/s/emml8gjinzd2ltvkoaxjcfmhf1lbfuir 950 PMMA Series Resists in Anisole] | |||
* [https://caltech.box.com/s/b9236z0q5mwrlieztlmz6yashjpd9qtk 950 PMMA Series Resists in Chlorobenzene] | |||
* [https://caltech.box.com/s/vi41cjm27b45uqjfiusl3vh87y8v5de4 Acetic Acid Glacial] | * [https://caltech.box.com/s/vi41cjm27b45uqjfiusl3vh87y8v5de4 Acetic Acid Glacial] | ||
* [https://caltech.box.com/s/3zz1ugq1qgtwmc29o54313sy8u7an9hd Acetone] | * [https://caltech.box.com/s/3zz1ugq1qgtwmc29o54313sy8u7an9hd Acetone] |
Revision as of 14:48, 27 July 2022
Chemicals Provided by the KNI with typical SDS
- 495 PMMA Series Resists in Anisole
- 495 PMMA Series Resists in Chlorobenzene
- 950 PMMA Series Resists in Anisole
- 950 PMMA Series Resists in Chlorobenzene
- Acetic Acid Glacial
- Acetone
- Aluminum Etchant Type A
- Aluminum Etchant Type D
- Ammonium Hydroxide (NH4OH)
- AZ 3330-F Photoresist
- AZ 400K Developer
- AZ 5214-E Photoresist
- AZ 726 MIF Developer
- AZ 9245 Photoresist
- AZ 9260 Photoresist
- AZ NLOF 2020 Photoresist
- AZ NLOF 2035 Photoresist
- AZ NLOF 2070 Photoresist
- AZ P4620 Photoresist
- CD 26 Developer
- Chromium Etchant CR-7S
- Citric Acid
- Copper Etchant APS-100
- Dichloromethane (Methylene Chlorine)
- Gold Etchant TFA
- Hexamethyldisilizane (HMDS)
- Hydrochloric Acid
- Hydrofluoric Acid Improved (BHF)
- Hydrogen Peroxide, 30% H2O2
- Isopropyl Alcohol (IPA)
- Methanol (Methyl alcohol)
- Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)
- MF 319 Developer
- Nano-strip and Nanostrip 2x
- Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)
- PGMEA (Propylene glycol monomethyl ether acetate)
- Phosphoric Acid (H3PO4)
- Potassium Hydroxide
- S1813 Photoresist
- SU-8 Developer
- Sulfuric Acid (H2SO4)
- Titanium Etchant TFT
- Titanium Etchant TFTN
- Tetramethylammonium Hydroxide 25% (TMAH)