Nova 600 NanoLab: SEM, Ga-FIB, GIS & Omniprobe: Difference between revisions

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===== Manufacturer Specifications =====
===== Manufacturer Specifications =====
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
* [https://caltech.box.com/s/nmws6w7643ne8mraljjar6c4epw0anpp Nova 600 NanoLab Data Sheet] (not all parameters apply to our instrument, see below for details specific to the KNI's Nova 600)
===== Scanning Electron Microscope (SEM) Specifications =====
===== SEM Specifications =====
* 0.5 to 30.0 kV
* 0.5 to 30.0 kV
* Apertures: 10 mm, 15 mm, 20 mmm, 30 mm
* Apertures: 10 mm, 15 mm, 20 mmm, 30 mm
* etc.
* etc.
===== Gallium Focused Ion Beam (Ga-FIB) Specifications =====
===== Ga-FIB Specifications =====
* 5.0 to 30.0 kV
* 5.0 to 30.0 kV
* 10 pA - 20 nA
* 10 pA - 20 nA
* etc.
* etc.

Revision as of 23:01, 24 April 2019

Nova 600 NanoLab
KNI-Si-and-Pt-Pillar.jpg
Instrument Type Microscopy
Techniques SEM, Ga-FIB, Omniprobe,
Immersion Lens Imaging,
GIS, Cross-sectioning,
TEM Lamella Sample Prep
Staff Manager Matthew S. Hunt, PhD
Staff Email matthew.hunt@caltech.edu
Staff Phone 626-395-5994
Reserve time on FBS
Request training via FBS User Dashboard
Lab Location B233B Steele
Lab Phone 626-395-1534
Manufacturer FEI (now Thermo Fisher)
Model {{{Model}}}
Nova-NanoLab-600.jpg

Description

The Nova 600 is a "dual beam" system that combines a scanning electron microscope (SEM) with a gallium focused ion beam (Ga-FIB). It can be used to capture high quality images (with sub-10 nm resolution) and perform site-specific etching and material deposition (with sub-50 nm resolution). It is also equipped with an Omniprobe lift-out system for TEM lamella sample preparation. See a full list of training and educational resources for this instrument below.

SEM Applications
  • Ultra-High-Resolution Imaging (Immersion Mode)
  • High-Resolution Imaging (Field-Free Mode)
  • Secondary Electron (SE) & Backscattered Electron (BSE) Imaging
  • Everhart-Thornley Detector (ETD) & Through-the-Lens Detector (TLD)
  • Platinum deposition via Gas Injection System (GIS)
Ga-FIB Applications
  • Directly etch patterns into material
  • Cutting & Imaging Cross-Sections
  • TEM Lamella Sample Preparation using an Omniprobe for Liftout
  • Platinum & SiOx deposition via GIS
  • Enhanced etch with XeF2 via GIS
  • Automated patterning with RunScript program & AutoScript language

Resources

SOPs & Troubleshooting
Video Tutorials
Graphical Handouts
Presentations
Manufacturer Manuals
Simulation Software
Order Your Own Stubs

Specifications

Manufacturer Specifications
SEM Specifications
  • 0.5 to 30.0 kV
  • Apertures: 10 mm, 15 mm, 20 mmm, 30 mm
  • etc.
Ga-FIB Specifications
  • 5.0 to 30.0 kV
  • 10 pA - 20 nA
  • etc.