Difference between revisions of "Equipment List"

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= Deposition =
= Deposition =
===== Evaporation =====
===== Evaporation =====
* Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline  
* Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
* Metals & Oxides: CHA Industries Mark 40
* Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
* Carbon: Leica EM ACE600 Carbon Evaporator
* Carbon: Leica EM ACE600 Carbon Evaporator
===== Sputtering =====
===== Sputtering =====
* Dielectric Sputterer: AJA International ATC Orion 8
* Dielectric Sputterer: AJA International ATC Orion 8

Revision as of 04:01, 18 April 2019

Lithography

Electron Beam Lithography
  • Electron Beam Pattern Generator: Raith EBPG 5200 (100 keV)
  • Electron Beam Pattern Generator: Raith EBPG 5000+ (100 keV)
  • Nanometer Pattern Generation System: Thermo Fisher Quanta 200F SEM with NPGS (1-30 keV)
  • Nanometer Pattern Generation System: Thermo Fisher Tecnai TF-20 S/TEM with NPGS (80-200 keV)
Ion Beam Lithography
  • He/Ne/Ga-FIB: Zeiss ORION NanoFab with Raith ELPHY MultiBeam Pattern Generator (5-40 keV He & Ne, 1-30 keV Ga)
Optical Lithography
  • Contact Mask Aligners: Suss MicroTec models MA6 & MA6/BA6
  • i-Line Wafer Stepper: GCA model 6300
  • Direct-Write Laser System: Heidelberg Instruments DWL-66
  • Two-Photon Lithography (aka Microscale 3D Printing): Nanoscribe Photonic Professional GT

Deposition

Evaporation
  • Metals (Al, Au, Pt & Ti): Kurt J Lesker Labline Electron Beam Evaporator
  • Metals & Oxides: CHA Industries Mark 40 Electron Beam Evaporator
  • Carbon: Leica EM ACE600 Carbon Evaporator
Sputtering
  • Dielectric Sputterer: AJA International ATC Orion 8
  • Chalcogenide Sputterer: AJA International ATC Orion 5
Chemical Vapor Deposition (CVD)
  • Atomic Layer Deposition (ALD): Oxford Instruments FlexAL II
  • Plasma-Enhanced Chemical Vapor Deposition (PECVD): Oxford Instruments System 100
Dielectric Packaging / Moisture Barrier
  • Parylene Coater: Para Tech LabTop 3000

Etching

Dry Etching
  • Silicon Etcher: Oxford Instruments DRIE System 100 Cryo ICP–RIE
  • Silicon, III/V Material & Metal Etcher: Oxford Instruments DRIE System 100 ICP–RIE
  • Dielectric Material Etcher: Oxford Instruments Dielectric System 100, 380 V source, ICP–RIE
  • Silicon, III/V Material & Organics Etcher: Plasmatherm RIE
  • Oxygen & Argon Plasma Cleaner: PIE Scientific Tergeo Plus ICP- & CCP-RIE
  • XeF2 Silicon Etcher
Wet Etching
  • Available Wet Chemistry Techniques

Microscopy

Focused Ion Beam (FIB) Systems
Scanning Electron Microscopes (SEMs)
Transmission Electron Microscopes (TEMs)
  • TEM/STEM/EDS/EELS/EFTEM/NPGS: Thermo Fisher Tecnai TF-20 (80-300 kV)
  • TEM/STEM/EDS/HAADF: Thermo Fisher Tecnai TF-30 (80-200 kV)
Scanning Probe Microscopes
  • Atomic Force Microscope (AFM): Bruker Dimension ICON
  • Profilometer: Veeco Dektak 3ST
Optical Characterization
  • Spectroscopic Ellipsometry: Woolam M-2000
  • Light Microscope: Olympus BX51M with Filmetrics model F40
  • Fluorescence Microscope: Olympus IX81

Support Tools

Thermal Processing
  • Tube Furnaces: Tystar Tytan 1 & 2 (Wet & Dry Oxidation and Annealing)
  • Rapid Thermal Processing: Modular Process Technology RTP-600S
  • Rapid Thermal Annealer: Jipelec Jetfirst 150
Substrate Processing
  • Scriber-Breaker: Dynatex GST-150
  • Wafer Bonder: Suss Microtech model SB6L
  • Critical Point Dryer: Tousimis Automegasamdri 915B
Device Processing
  • Wedge-Wedge Wire Bonder: Westbond model 7476D-79
  • Electrical Probing Station: Cascade Microtech M150