View source for Dual Chamber RIE: Silicon, III-V Material & Organics Etcher

{{InstrumentInfoboxOneImage|
|InstrumentName = Dual Chamber RIE
|HeaderColor = #FFE2B9
|ImageOne = Dual-Chamber-RIE_Plasma-Therm-SLR.jpg
|ImageTwo = 
|InstrumentType = [[Equipment_List#Etching|Etching]]
|RoomLocation = B235 Steele
|LabPhone = 626-395-1532
|PrimaryStaff = [[Kelly McKenzie]]
|StaffEmail = kmmckenz@caltech.edu
|StaffPhone = 626-395-5732
|Manufacturer = Plasma-Therm
|Model = SLR 720
|Techniques = Silicon and<br>compound semiconductor<br>Reactive Ion Etching
|EmailList =  kni-plasmatherm
|EmailListName = Plasmatherm RIE
}}
== Description ==
The Plasma-Therm SLR 720 is a dual-chamber reactive ion etching (RIE) system with a load-lock. It is designated for etching silicon semiconductors with a traditional RIE process.
===== Applications =====
* Silicon Etching
* Organic Material Etching

===== Allowed Material in RIE =====
* Si, Si<sub>x</sub>N<sub>y</sub>, SiO<sub>2</sub>, Ge
* PMMA/ZEP/SPR/AZ/maN resists, SiO<sub>x</sub>/Al<sub>2</sub>O<sub>3</sub> hard masks
* Buried/backside metal ok if never exposed (not an etch stop)

===== RIE Gas List =====
* SF<sub>6</sub>
* CHF<sub>3</sub>
* CF<sub>4</sub>
* O<sub>2</sub>
* Ar
* He
* H<sub>2</sub>

== Resources ==
===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/jsskat7yic4p7td31941dxuj97ja6er5 KNI SOP]
* [https://caltech.box.com/s/681uz0b8zsv6ivy43a5ggsoydp5zlyza Oxfords and RIE reservation and use policy]
* [https://caltech.box.com/s/4qbaqhklg9bak0hlgd469d1ixxtttgxp Etcher toxic gas handling SOP]

===== Process Documents =====
* [https://caltech.box.com/s/3n21r2o30u476ppnxfp657o3zbs9f0on Process Standards]
* [https://caltech.box.com/s/wemw91xtjrh7ac34ks9ai3lv1oujivxa Al2O3 Etch in Oxford ICP and Plasmatherm RIE]

===== Review Articles =====
* [https://caltech.box.com/s/3fnc4a7qeyr1up6kth599j7ojybka2vb Guidelines for Etching Silicon MEMS Structures]
* [https://caltech.box.com/s/j61w7vr4f8cdjr64jrnz1t37oizdhl7f Etch rates for MEMS Processing - Part I]
* [https://caltech.box.com/s/ls0jl268j4at6z39g6kv8wivevpq80eh Etch Rates for MEMS Processing - Part II]
* [https://caltech.box.com/s/cetpre7d66gssbhtaicnhtovyo6ngzjv Dry Etching of Electronic Oxides, Polymers, and Semiconductors]
* [https://caltech.box.com/s/pauf384duhejuwzfwan71eam7nkvdrxw Alumina etch masks for fabrication of high-aspect-ratio silicon micropillars and nanopillars]

===== Manufacturer Manuals =====
* In progress

== Specifications ==
===== Manufacturer Specifications =====
* In progress
===== System Features =====
* In progress
===== System Specifications =====
* In progress


== Related Tools ==
* [https://lab.kni.caltech.edu/ICP-RIE:_III-V,_Metal_%26_Silicon_Etcher Oxford III-V ICP-RIE]
* [https://lab.kni.caltech.edu/ICP-RIE:_Dielectric_Etcher Oxford Dielectric ICP-RIE]
* [https://lab.kni.caltech.edu/DRIE:_Bosch_%26_Cryo_ICP-RIE_for_Silicon Oxford DRIE ICP-RIE]
* [https://lab.kni.caltech.edu/XeF2_Etcher_for_Silicon XeF2 Etcher]
* [https://lab.kni.caltech.edu/Plasma-Enhanced_Chemical_Vapor_Deposition_(PECVD) Oxford PECVD]
* [https://lab.kni.caltech.edu/FlexAL_II:_Atomic_Layer_Deposition_(ALD) Oxford ALD]