Contact Mask Aligners: MA6 & MA6/BA6
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Description
The contact mask aligner is a tool that enables front- and back-side alignment of photo masks to create structures as small as 500 nm on sample sizes up to 6 inches. These systems are ideally suited for rapid definition of sub-micron devices through contact printing, and enable the high-resolution alignment of several lithographic layers to define complex devices. They are typically used to define contacts and connections to the nanostructures that are defined using the KNI's other fabrication instruments (e.g. e-beam lithography). The MA6/BA6 is also configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder.
Suss1 MA6/BA6 Applications
- Front Side Flood Exposure (no mask)
- Front Side Alignment & Exposure
- Back Side Alignment with Front Side Exposure
Suss2 MA6 Applications
- Front Side Alignment & Exposure
- Back Side Alignment with Front Side Exposure
Resources
SOPs & Troubleshooting
Manufacturer Manuals
Specifications
Manufacturer Specifications
- Whole wafers 2” up to 6” can be loaded.
- Samples pieces up to 6”x6” square can be loaded.
- Samples up to 6mm thick can be loaded..
- Exposure Resolution:
- Soft Contact Mode = 1 - 2 um
- Hard Contact Mode = 1 um
- Soft Vacuum Contact Mode = 1 - 0.5 um
- Vacuum Contact Mode = 0.4 - 0.5 um
Suss 1 Exposure Settings
- Channel 1 is 365nm wavelength at 15 mW/cm2.
- Channel 2 is 405nm wavelength at 25 mW/cm2.
Suss 2 Exposure Settings
- Channel 1 is 365nm wavelength at 10 mW/cm2.
- Channel 2 is 405nm wavelength at 15 mW/cm2.