Difference between revisions of "Contact Mask Aligners: MA6 & MA6/BA6"
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* [https://caltech.box.com/s/gkhncvqe25uccym7cs5aj0n00krbmnw1 General SOP & Troubleshooting] | * [https://caltech.box.com/s/gkhncvqe25uccym7cs5aj0n00krbmnw1 General SOP & Troubleshooting] | ||
* [https://caltech.box.com/s/bbk4f9vi6jerhi9fcqoqa78n5npkwxkr Lamp Change SOP] | * [https://caltech.box.com/s/bbk4f9vi6jerhi9fcqoqa78n5npkwxkr Lamp Change SOP] | ||
===== Process Recipes ===== | |||
* [https://caltech.box.com/s/5ls5rk4oanod66pfilsuendthutcmfqu AZ5214 resist spinning recipe] | |||
* [https://caltech.box.com/s/quqnspqndxtyo8jz0l37j7n9n3l40w5a S1813 resist spinning recipe] | |||
===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
Revision as of 00:32, 8 November 2019
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Description
The contact mask aligner is a tool that enables front- and back-side alignment of photo masks to create structures as small as 500 nm on sample sizes up to 6 inches. These systems are ideally suited for rapid definition of sub-micron devices through contact printing, and enable the high-resolution alignment of several lithographic layers to define complex devices. They are typically used to define contacts and connections to the nanostructures that are defined using the KNI's other fabrication instruments (e.g. e-beam lithography). The MA6/BA6 is also configured to do bond aligning in support of the Suss Microtec SB6L Wafer Bonder.
Suss1 MA6/BA6 Applications
- Front Side Flood Exposure (no mask)
- Front Side Alignment & Exposure
- Back Side Alignment with Front Side Exposure
Suss2 MA6 Applications
- Front Side Alignment & Exposure
- Back Side Alignment with Front Side Exposure
Resources
SOPs & Troubleshooting
Process Recipes
Manufacturer Manuals
Specifications
Manufacturer Specifications
- Whole wafers 2” up to 6” can be loaded.
- Samples pieces up to 6”x6” square can be loaded.
- Samples up to 6mm thick can be loaded..
- Exposure Resolution:
- Soft Contact Mode = 1 - 2 um
- Hard Contact Mode = 1 um
- Soft Vacuum Contact Mode = 1 - 0.5 um
- Vacuum Contact Mode = 0.4 - 0.5 um
Suss 1 Exposure Settings
- Channel 1 is 365nm wavelength at 15 mW/cm2.
- Channel 2 is 405nm wavelength at 25 mW/cm2.
Suss 2 Exposure Settings
- Channel 1 is 365nm wavelength at 10 mW/cm2.
- Channel 2 is 405nm wavelength at 15 mW/cm2.