Scriber-Breaker: Difference between revisions
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===== Manufacturer Manuals ===== | ===== Manufacturer Manuals ===== | ||
* [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Dynatex GST-150 Manual] | * [https://caltech.box.com/s/1cf8rglz8bj6olhm1sjr77uu885yrb5h Dynatex GST-150 Manual] | ||
* [https://caltech.box.com/s/2hbk1r4847wru8tqayxjkw0soejpvx0k Scribe & Break Theory for GST-150] | |||
== Specifications == | == Specifications == | ||
Revision as of 15:29, 28 January 2020
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Description
The scriber-breaker uses a dry scribing and breaking technique to allow cleaner separation of dies on a wafer than can be done with a wet cutting saw. Some advantages are that the elimination of deionized water protects delicate structures on the wafer surface, decreasing street sizes of existing wafers, and allowing for the dicing of difficult-to-manage substrates. Many compound semiconductors can be challenging when dicing, and the dry scribe-break technology is successful for such materials.
Applications
- Scribing and/or breaking wafers
Resources
SOPs & Troubleshooting
Manufacturer Manuals
Specifications
Specifications
- Accommodated Sizes: up to 6" wafers
- Acceptable Materials: InP, GaAs, or Silicon substrates.