Wet Chemistry: Difference between revisions
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* Solvents | * Solvents | ||
* Electroplating | * Electroplating | ||
===== Chemicals Provided by the KNI ===== | ===== Chemicals Provided by the KNI with typical SDS===== | ||
* Acetic Acid | * [https://caltech.box.com/s/e9aenw9ddp2mubkvqkxqd3mtfohp7xz1 Acetic Acid Glacial] | ||
* Acetone | * [https://caltech.box.com/s/3zz1ugq1qgtwmc29o54313sy8u7an9hd Acetone] | ||
* Aluminum Etchant A | * [https://caltech.box.com/s/a8n0s5au2cucnsfqlwh2wctml3imigwb Aluminum Etchant Type A] | ||
* | * Aluminum Etchant D | ||
* Ammonium Hydroxide | * [https://caltech.box.com/s/qi5n4uow7kq9aq04y1z3glb4jnzsjr89 Ammonium Hydroxide (NH<sub>4</sub>OH)] | ||
* Au Etchant | * Au Etchant | ||
* AZ | * [https://caltech.box.com/s/oet38b107t13e5eyua3p5u40imggnqqs AZ 400K Photoresist Developer] | ||
* AZ 726 | * [https://caltech.box.com/s/xsouakt5afpirwsj2t2otve9bqo6nkzx AZ 726 MIF Developer] | ||
* | * AZ 4620 | ||
* AZ 5214 E | * [https://caltech.box.com/s/lsa4wk6vktuuh4itqzv9r3k0yql38dwi AZ 5214-E Photoresist] | ||
* Buffered | * [https://caltech.box.com/s/fl0p67vj2gtucz6896taed5wu9thdoeo Buffered HF Improved] | ||
* CD | * [https://caltech.box.com/s/nbbptm14e4ejc5kc9bjm8x0aa074pnla CD 26 Developer] | ||
* | * [https://caltech.box.com/s/ejr2qph7nits1eaelm1f21s1oowrou0d Chromium Etchant CR-7S] | ||
* Citric Acid | * Citric Acid | ||
* Copper Etchant | * Copper Etchant | ||
* | * [https://caltech.box.com/s/y2o9z1zt1kor0we7erdkfyruxgyp82h7 Hexamethyldisilizane (HMDS)] | ||
* Hydrochloric Acid | * [https://caltech.box.com/s/m1icrzidd6tw2ql7zke5p9v3mq2fx0br Hydrochloric Acid] | ||
* Hydrofluoric Acid (HF) | * Hydrofluoric Acid (HF) | ||
* Hydrogen Peroxide | * [https://caltech.box.com/s/jg1y0btpel4fpylh7vonld9gykvp6plg Hydrogen Peroxide, 30% H<sub>2</sub>O<sub>2</sub>] | ||
* Isopropyl Alcohol (IPA) | * [https://caltech.box.com/s/7c02l4sctvfx0wplr4k6429yi0j8ew5q Isopropyl Alcohol (IPA)] | ||
* Methanol | * [https://caltech.box.com/s/mk4rilpjcbd5ryjb1tw764eau62mjq7f Methanol] | ||
* Methyl | * [https://caltech.box.com/s/tf1ty82wcbf68l7gekqsna3ajuiljhkw Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)] | ||
* Methylene | * [https://caltech.box.com/s/fip81rmqz0x1pw031zqg7blun11617mv Methylene Chlorine (Dichloromethane)] | ||
* MF 319 | * [https://caltech.box.com/s/w1fp48vpymlru0675o28tuugig7bmevv MF 319 Developer] | ||
* | * [https://caltech.box.com/s/mewj3293pbgyjj3zxupoj0uo9i4hv0c7 Nano-strip and Nanostrip 2x] | ||
* [https://caltech.box.com/s/kqdon6279rxtna894s6qzgah7xn3p0ld Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)] | |||
* PG Remover (N-Methyl-2-Pyrrolidone) | |||
* PGMEA | * PGMEA | ||
* Phosphoric Acid (H<sub>3</sub>PO<sub>4</sub>) | * [https://caltech.box.com/s/44slar2g3q5cbe9vrpg5tq7viwq1v6vm Phosphoric Acid (H<sub>3</sub>PO<sub>4</sub>)] | ||
* Potassium Hydroxide | * [https://caltech.box.com/s/41wp3geih92ydmu1jrv5f4spms6j1utg Potassium Hydroxide] | ||
* SU-8 Developer | * [https://caltech.box.com/s/avqs14mt28i1epom0n6w37p55rjqvkbe SU-8 Developer] (Micro-Chem) | ||
* Sulfuric Acid (H<sub>2</sub>SO<sub>4</sub>) | * [https://caltech.box.com/s/89j0lgduzv1hqnewgfr5rrkigxcpw5b3 Sulfuric Acid (H<sub>2</sub>SO<sub>4</sub>)] | ||
* Titanium Etchant | * [https://caltech.box.com/s/9ht2pznbmygzrau5bgp4yuom65h3wk4u Titanium Etchant TFT] | ||
* Tetramethylammonium Hydroxide (TMAH) | * [https://caltech.box.com/s/976lv8b4ka4oupr7nkfb8g1pill79usn Tetramethylammonium Hydroxide 25% (TMAH)] | ||
===== Approved Chemicals ===== | ===== Approved Chemicals ===== | ||
Revision as of 20:49, 28 May 2019
|
Facilities and Chemicals
Available Benches
- Acids
- Hydrofluoric Acid (HF)
- Bases
- Potassium Hydroxide (KOH)
- Solvents
- Electroplating
Chemicals Provided by the KNI with typical SDS
- Acetic Acid Glacial
- Acetone
- Aluminum Etchant Type A
- Aluminum Etchant D
- Ammonium Hydroxide (NH4OH)
- Au Etchant
- AZ 400K Photoresist Developer
- AZ 726 MIF Developer
- AZ 4620
- AZ 5214-E Photoresist
- Buffered HF Improved
- CD 26 Developer
- Chromium Etchant CR-7S
- Citric Acid
- Copper Etchant
- Hexamethyldisilizane (HMDS)
- Hydrochloric Acid
- Hydrofluoric Acid (HF)
- Hydrogen Peroxide, 30% H2O2
- Isopropyl Alcohol (IPA)
- Methanol
- Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)
- Methylene Chlorine (Dichloromethane)
- MF 319 Developer
- Nano-strip and Nanostrip 2x
- Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)
- PGMEA
- Phosphoric Acid (H3PO4)
- Potassium Hydroxide
- SU-8 Developer (Micro-Chem)
- Sulfuric Acid (H2SO4)
- Titanium Etchant TFT
- Tetramethylammonium Hydroxide 25% (TMAH)