Wet Chemistry: Difference between revisions
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|EmailListName = Chemistry | |EmailListName = Chemistry | ||
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== | == Facilities and Chemicals == | ||
===== Available Benches ===== | ===== Available Benches ===== | ||
* Acids | * Acids | ||
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* Aluminum Etchant A | * Aluminum Etchant A | ||
* Alumnium Etchant D | * Alumnium Etchant D | ||
* Ammonium Hydroxide BDH chemicals ( | * Ammonium Hydroxide BDH chemicals (NH<sub>4</sub>OH) | ||
* Ammonium Hydroxide JT Baker | * Ammonium Hydroxide JT Baker | ||
* Au Etchant | * Au Etchant | ||
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* AZ 5214 E IR | * AZ 5214 E IR | ||
* Buffered Hydrofluoric Acid (BHF) | * Buffered Hydrofluoric Acid (BHF) | ||
* CD-26 | * CD-26 Developer | ||
* Chrome Etchant | * Chrome Etchant | ||
* Citric Acid | * Citric Acid | ||
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* Hydrofluoric Acid (HF) | * Hydrofluoric Acid (HF) | ||
* Hydrogen Peroxide (H<sub>2</sub>O<sub>2</sub>) | * Hydrogen Peroxide (H<sub>2</sub>O<sub>2</sub>) | ||
* Isopropyl | * Isopropyl Alcohol (IPA) | ||
* Methanol | * Methanol | ||
* Methyl Iso Butyl Ketone (MIBK) | * Methyl Iso Butyl Ketone (MIBK) | ||
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* Nanostrip | * Nanostrip | ||
* Nanostrip 2x | * Nanostrip 2x | ||
* PG Remover | * PG Remover (N-Methyl-2-Pyrrolidone) | ||
* PGMEA | * PGMEA | ||
* Phosphoric Acid (H<sub>3</sub>PO<sub>4</sub>) | * Phosphoric Acid (H<sub>3</sub>PO<sub>4</sub>) | ||
Revision as of 16:48, 28 May 2019
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Facilities and Chemicals
Available Benches
- Acids
- Hydrofluoric Acid (HF)
- Bases
- Potassium Hydroxide (KOH)
- Solvents
- Electroplating
Chemicals Provided by the KNI
- Acetic Acid, Glacial
- Acetone
- Aluminum Etchant A
- Alumnium Etchant D
- Ammonium Hydroxide BDH chemicals (NH4OH)
- Ammonium Hydroxide JT Baker
- Au Etchant
- AZ 400 Photoresist Developer
- AZ 726 Photoresist Developer
- AZ4620
- AZ 5214 E IR
- Buffered Hydrofluoric Acid (BHF)
- CD-26 Developer
- Chrome Etchant
- Citric Acid
- Copper Etchant
- Hexamethyldisilazane (HMDS)
- Hydrochloric Acid (HCl)
- Hydrofluoric Acid (HF)
- Hydrogen Peroxide (H2O2)
- Isopropyl Alcohol (IPA)
- Methanol
- Methyl Iso Butyl Ketone (MIBK)
- Methylene Chloride (Dichloromethane)
- MF 319
- Nanostrip
- Nanostrip 2x
- PG Remover (N-Methyl-2-Pyrrolidone)
- PGMEA
- Phosphoric Acid (H3PO4)
- Potassium Hydroxide (KOH)
- SU-8 Developer
- Sulfuric Acid (H2SO4)
- Titanium Etchant
- Tetramethylammonium Hydroxide (TMAH)