Provided Chemicals: Difference between revisions
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* [https://caltech.box.com/s/p0ipw68eugayo2skq1hqgnj7vdl8m46f Citric Acid] | * [https://caltech.box.com/s/p0ipw68eugayo2skq1hqgnj7vdl8m46f Citric Acid] | ||
* [https://caltech.box.com/s/s7sy48utmmndn20pxn4izq6e433hkcj8 Copper Etchant APS-100] | * [https://caltech.box.com/s/s7sy48utmmndn20pxn4izq6e433hkcj8 Copper Etchant APS-100] | ||
* [https://caltech.box.com/s/fip81rmqz0x1pw031zqg7blun11617mv Dichloromethane (Methylene Chlorine)] | * [https://caltech.box.com/s/fip81rmqz0x1pw031zqg7blun11617mv Dichloromethane (Methylene Chlorine)] | ||
* [https://caltech.box.com/s/4yhh2gx40o6l94edtkh4q277brs18h69 EpoThin-2-Hardener] | * [https://caltech.box.com/s/4yhh2gx40o6l94edtkh4q277brs18h69 EpoThin-2-Hardener] | ||
Revision as of 16:25, 12 March 2024
Chemicals Provided by the KNI with typical SDS
- 495 PMMA Series Resists in Anisole
- 495 PMMA Series Resists in Chlorobenzene
- 950 PMMA Series Resists in Anisole
- 950 PMMA Series Resists in Chlorobenzene
- Acetic Acid Glacial
- Acetone
- Aluminum Etchant Type A
- Aluminum Etchant Type D
- Ammonium Hydroxide (NH4OH)
- AZ 3330-F Photoresist
- AZ 400K Developer
- AZ 5214-E Photoresist
- AZ 726 MIF Developer
- AZ 9245 Photoresist
- AZ 9260 Photoresist
- AZ NLOF 2020 Photoresist
- AZ NLOF 2035 Photoresist
- AZ NLOF 2070 Photoresist
- AZ P4620 Photoresist
- CD 26 Developer
- Chromium Etchant CR-7S
- Citric Acid
- Copper Etchant APS-100
- Dichloromethane (Methylene Chlorine)
- EpoThin-2-Hardener
- EpoThin-2-Resin
- Gold Etchant TFA
- Hexamethyldisilizane (HMDS)
- Hydrochloric Acid
- Hydrofluoric Acid (Buffered HF Improved - BHF)
- Hydrofluoric Acid 49%
- Hydrogen Peroxide, 30% H2O2
- Isopropyl Alcohol (IPA)
- Methanol (Methyl alcohol)
- Methyl Isobutyl Ketone (MIBK, 4-Methyl-2-pentanone)
- MF 319 Developer
- NanoStrip - no longer available see Pure Strip
- PGMEA (Propylene glycol monomethyl ether acetate)
- Phosphoric Acid (H3PO4)
- Potassium Hydroxide
- Pure Strip (NanoStrip replacement)
- Release Agent
- Remover PG, Photoresist Remover (N-Methyl-2-Pyrrolidone)
- S1805 Photoresist
- S1813 Photoresist
- S1818 Photoresist
- SU-8 Developer
- Sulfuric Acid (H2SO4)
- Titanium Etchant TFT
- Titanium Etchant TFTN
- Tetramethylammonium Hydroxide 25% (TMAH)