Wafer Bonder: Difference between revisions
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|InstrumentType = [[Equipment_List#Support_Tools|Support Tools]],<br>[[Equipment_List#Substrate_Processing|Substrate Processing]] | |InstrumentType = [[Equipment_List#Support_Tools|Support Tools]],<br>[[Equipment_List#Substrate_Processing|Substrate Processing]] | ||
|RoomLocation = B217 Steele | |RoomLocation = B217 Steele | ||
|LabPhone = 626-395- | |LabPhone = 626-395-4075 | ||
|PrimaryStaff = [[ | |PrimaryStaff = [[Nathan Lee]] | ||
|StaffEmail = | |StaffEmail = nathslee@caltech.edu | ||
|StaffPhone = 626-395- | |StaffPhone = 626-395-4386 | ||
|Manufacturer = Suss Microtec | |Manufacturer = Suss Microtec | ||
|Model = SBL6 | |Model = SBL6 | ||
|Techniques = Pressure/Heat Bonding | |Techniques = Pressure/Heat Bonding | ||
|RequestTraining = | |RequestTraining = nathslee@caltech.edu | ||
|EmailList = kni-sb6l | |EmailList = kni-sb6l | ||
|EmailListName = Wafer Bonder | |EmailListName = Wafer Bonder | ||
Revision as of 18:36, 14 April 2026
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Description
The SB6L wafer bonder applies force and heat to the back side of two wafers in a vacuum chamber in order to bond them face to face. An automatic recipe can be created with control over bonding pressure, temperature, and chamber pressure as well as ramp & duration of any process step. Since heat and temperature can be controlled separately, temperature-sensitive materials such as polymers may be bonded.
Applications
- MEMS & Microelectronics Fabrication
Resources
SOPs
- KNI SB6L SOP - Operating Instructions for the Suss SB6L Wafer Bonder
Manufacturer Manuals
- SB6L User Manual - The SUSS SB6L Wafer Bonder System User Manual
- NP12 User Manual - The SUSS NP 12™ Plasma Activation System User Manual
- Suss Micro Tec Process Manual -The Wafer Bonding Process Manual contains information on the different types of substrate bonding applications.