View source for Labline: Electron Beam Evaporator

{{InstrumentInfoboxOneImage|
|InstrumentName = Labline Evaporator
|HeaderColor = #F2682A
|ImageOne = KJLC-Labline-Metal-Evaporator.jpg
|ImageTwo = 
|InstrumentType = [[Equipment_List#Deposition|Deposition]]
|RoomLocation = B235C Steele
|LabPhone = 626-395-1539
|PrimaryStaff = [[Alex Wertheim]]
|StaffEmail = alexw@caltech.edu
|StaffPhone = 626-395-3371
|Manufacturer = Kurt J. Lesker Company
|Model = Labline
|Techniques = E-beam Evaporation,<br>Ion-Assisted Deposition (IAD),</br>Ion Milling
|EmailList = kni-labline
|EmailListName =  Labline
}}
== Description ==
The Labline electron beam evaporator system is a load-locked platform with a cryopump for fast sample turnaround and a user-friendly interface for precise control of film parameters during deposition. It is fitted with a Kaufman and Robinson EH 400 End-Hall permanent magnet ion source that can be used for cleaning substrates and ion-assisted deposition during evaporation.

===== Applications =====
* Metal deposition (Ti, Pt, Au, Al)
* Lift-off
* Non-selective etch
* Ion-assisted deposition (simultaneous etching & deposition)

== Resources ==
===== Equipment Status =====
* [https://labrunr.caltech.edu/Equipment_2.aspx LabRunr Equipment Status] (Select Ebeam_Lesker from the dropdown menu)

===== SOPs & Troubleshooting =====
* [https://caltech.box.com/s/9sx2vhd9gz5rdhviexii8hj6lftvxguy KNI SOP]
* [https://caltech.box.com/s/sqfi1s85wykxzecvt0mqdv5fr27nggvc Troubleshooting Guide]

=== Tool Reservation Rules ===
{| class="wikitable"
|-
!  !! Advanced Reservation (days) !! Limit per Reservation (hrs) !! Limit per week (hrs)
|-
| Weekday || 7 || 6 || 18
|-
| Weeknight || 7 || 8 || 18
|-
| Weekend || 7 || 12 || 18
|}

===== Video Tutorials =====
* [https://youtu.be/jq5M7fkgpfM Labline Training]
* [https://youtu.be/5C6It9YO_jg Sample Load & Transfer]

== Specifications ==
===== Hardware Specifications =====
* Typical base pressure: 1E-7 to 1E-8 Torr
* All dry pumping system (cryo & scroll pumps)
* Load-lock-equipped system with manual wafer transfer
* Evaporation Source: 1x single emitter, 4-pocket e-beam evaporation source
* 1x Argon ion source (Filament type)
* Accepts up to 1x 150mm wafer or smaller wafers/pieces

== Related Instrumentation in the KNI ==
===== Sputtering Systems =====
* [[ATC Orion 8: Chalcogenide Sputter System|ATC Orion 8: Chalcogenide Sputter System]]
* [[ATC Orion 8: Dielectric Sputter System|ATC Orion 8: Dielectric Sputter System]]

===== Electron Beam Evaporation Systems =====
* [[CHA: Electron Beam Evaporator|CHA: Electron Beam Evaporator]]

===== Chemical Vapor Deposition =====
* [[FlexAL II: Atomic Layer Deposition (ALD)|FlexAL II: Atomic Layer Deposition (ALD)]]
* [[Plasma-Enhanced Chemical Vapor Deposition (PECVD)|Plasma-Enhanced Chemical Vapor Deposition (PECVD)]]