Wet Chemistry Resources

Sample Cleaning Resources

• Handbook of Silicon Wafer Cleaning Technology

• UC Irvine Cleaning Procedures for Silicon

• BYU Substrate Cleaning Guide

• https://www.microsi.com/silicon-wafer-cleaning/

Solvent Cleans

• UIUC Wafer Cleaning Procedure

• Acetone, IPA -Acetone serves as a solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
• Acetone, Methanol -Similar to above except Methanol is more toxic, and a polar molecule versus IPA which is non-polar
• Acetone, Methanol, IPA
• Acetone, Methanol, IPA, DI Water
• Remover PG (60°C), IPA -Caution, low flashpoint, do not leave unattended
  • Nano Remover PG Spec Sheet
  • Columbia University Remover PG Process
• Dichloromethane, IPA -Caution, high evaporation rate may leave residue and beakers quickly condense water/ice
• Nanostrip (60°C) -Rinse with DI
  • https://www.seas.upenn.edu/~nanosop/Nanostrip_SOP.htm
  • https://braungroup.beckman.illinois.edu/files/2018/02/SOP_BI-005_Nanostrip.pdf

Etching Cleans

Caution. All of these processes require a buddy and adequate chemical safety training.

RCA-1

Prepares wafers for high-temperature processing steps. Standardized protocol developed by RCA in 1960s.

• https://en.wikipedia.org/wiki/RCA_clean

Piranha Etch

Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface. If there is significant organic contamination, perform solvent clean prior.

• UMich LNF Piranha Etch

• McMaster University Piranha Etch

• Boston University Piranha Etch

• Caltech MMRC Piranha Etch

HF Dip

Removes native oxide from surfaces.

• UCI Irvine HF 2% Dip

• UBC BOE Etch and HF Dip

Plasma Cleans

Plasma cleaning via oxygen, argon, etc. may be the more optimal choice for certains samples such as fragile membranes. More information can be found on the tool page for the Tergeo Plus Plasma Cleaner.

Wet Etching Resources

Research Papers and Books

• Etch Rates for Micromachining Processing

• Etch Rates for Micromachining Processing-Part II

• Handbook of Metal Etchants

External Laboratories

• BYU Etching list

• UMich Wet Etching info

• BYU Etching Guidance

• UCSB Wet Etching Recipes

• Berkeley Marvell Nanofab Process Manual

• BYU KOH processing

• UC Irvine KOH Etching

• U Alberta KOH Etching

Commercial Materials

• Transene Etch Compatibility Chart

• Transene Etchant List

• MicroChemicals trove of application notes

KNI Wet Etch Recipes Table

Table of Wet Etch recipes from KNI Papers

And general table from you, not from papers, maybe from recipes?

Material	Etchant	Rate (nm/min)	Anisotropy	Selective to	Selectivity	Origin and Notes
KNI CHA Al	Al Etch Type D	~1000	Highly	Al	High	Matches Transene's expected rate
KNI PECVD 350°C SiO2	HF	~1000	Highly	SiO2	High	measured 10/19
KNI PECVD 350°C Si3N4	Ex	~1000	Highly	SiN3	High	measured 10/19
KNI PECVD a-Si	KOH	~1000	Highly	Si	High	Link to KNI member's research paper

Other Procedures

Liftoff

• UCSB liftoff guidance

Electroplating

• Technic electroplating materials supplier

Safety Resources

Do we have materials to link to?

https://cleanroom.byu.edu/acid_safety

https://cleanroom.byu.edu/HF_safety

https://cleanroom.byu.edu/solvent_safety