Difference between revisions of "Wet Chemistry Resources"

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===Piranha Etch===
===Piranha Etch===
Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface.  If there is significant organic contamination, perform solvent clean prior.


*[http://lnf-wiki.eecs.umich.edu/wiki/Piranha_Etch UMich LNF Piranha Etch]
*[http://lnf-wiki.eecs.umich.edu/wiki/Piranha_Etch UMich LNF Piranha Etch]

Revision as of 23:23, 3 November 2019

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Sample Cleaning Resources

Solvent Cleans

Etching Cleans

RCA-1

Prepares wafers for high-temperature processing steps. Standardized protocol developed by RCA in 1960s.

Piranha Etch

Strong oxidant solution, removes organics and some metals from surfaces and reestablishes oxidized surface. If there is significant organic contamination, perform solvent clean prior.

HF Dip

Plasma Cleans

Wet Etching Resources

Research Papers and Books

External Laboratories

Commercial Materials

KNI Wet Etch Recipes Table

Table of Wet Etch recipes from KNI Papers

And general table from you, not from papers, maybe from recipes?

Material Etchant Rate (nm/min) Anisotropy Selective to Selectivity Origin and Notes
KNI CHA Al Al Etch Type D ~1000 Highly Al High Matches Transene's expected rate
KNI PECVD SiO2 HF ~1000 Highly SiO2 High measured 10/19
KNI PECVD SiN3 Ex ~1000 Highly SiN3 High measured 10/19
KNI PECVD a-Si KOH ~1000 Highly Si High Link to KNI member's research paper

Other Procedures

Liftoff

Electroplating

Safety Resources

Do we have materials to link to?

https://cleanroom.byu.edu/acid_safety

https://cleanroom.byu.edu/HF_safety

https://cleanroom.byu.edu/solvent_safety