Wet Chemistry Resources

Sample Cleaning Resources

• Handbook of Silicon Wafer Cleaning Technology

• UC Irvine Cleaning Procedures for Silicon

• BYU Substrate Cleaning Guide

• https://www.microsi.com/silicon-wafer-cleaning/

Solvent Cleans

• UIUC Wafer Cleaning Procedure

• Acetone, IPA -Acetone serves as a solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
• Acetone, Methanol -Similar to above except Methanol is more toxic, and a polar molecule versus IPA which is non-polar
• Acetone, Methanol, IPA
• Acetone, Methanol, IPA, DI Water
• Remover PG (60°C), IPA -Caution, low flashpoint, do not leave unattended
  • Nano Remover PG Spec Sheet
  • Columbia University Remover PG Process
• Dichloromethane, IPA -Caution, high evaporation rate may leave residue and beakers quickly condense water/ice
• Nanostrip (60°C) -Rinse with DI
  • https://www.seas.upenn.edu/~nanosop/Nanostrip_SOP.htm
  • https://braungroup.beckman.illinois.edu/files/2018/02/SOP_BI-005_Nanostrip.pdf

Etching Cleans

RCA-1

Prepares wafers for high-temperature processing steps. Standardized protocol developed by RCA in 1960s.

• https://en.wikipedia.org/wiki/RCA_clean

Piranha Etch

• UMich LNF Piranha Etch

• McMaster University Piranha Etch

• Boston University Piranha Etch

• Caltech MMRC Piranha Etch

Wet Etching Resources

Research Papers and Books

• Etch rates for micromachining processing

• Etch rates for micromachining processing-Part II

• Handbook of Metal Etchants

External Laboratories

• BYU Etching list

• UMich wet etch info

• BYU Etching Guidance

• UCSB Wet Etching Recipes

• Berkeley Marvell Nanofab

• BYU KOH processing

• UC Irvine KOH Etching

• U Alberta KOH Etching

Commercial Materials

• Transene Etch Compatibility Chart

• Transene Etchant List

• MicroChemicals trove of application notes

KNI Wet Etch Recipes Table

Table of Wet Etch recipes from KNI Papers

And general table from you, not from papers, maybe from recipes?

Material	Etchant	Rate (nm/min)	Anisotropy	Selective to	Selectivity	Origin and Notes
KNI CHA Al	Al Etch Type D	~1000	Highly	Al	High	Matches Transene's expected rate
KNI PECVD SiO2	HF	~1000	Highly	SiO2	High	measured 10/19
KNI PECVD SiN3	Ex	~1000	Highly	SiN3	High	measured 10/19
KNI PECVD a-Si	KOH	~1000	Highly	Si	High	Link to KNI member's research paper

Other Procedures

Liftoff

• UCSB liftoff guidance

Electroplating

• Technic electroplating materials supplier

Safety Resources

Do we have materials to link to?

https://cleanroom.byu.edu/acid_safety

https://cleanroom.byu.edu/HF_safety

https://cleanroom.byu.edu/solvent_safety