Difference between revisions of "Wet Chemistry Resources"

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*'''Acetone, Methanol, IPA'''
*'''Acetone, Methanol, IPA'''
*'''Acetone, Methanol, IPA, DI Water'''
*'''Acetone, Methanol, IPA, DI Water'''
*'''Remover PG (60°C), IPA'''
*'''Remover PG (60°C), IPA''' -Caution, low flashpoint, do not leave unattended
**Nano Remover PG Spec Sheet
**Nano Remover PG Spec Sheet
**[https://static1.squarespace.com/static/57b26cc76b8f5b7524bf9ed2/t/57f9725d725e25a7b5dd12fe/1475965533625/Remover-PG-Process.pdf Columbia University Remover PG Process]
**[https://static1.squarespace.com/static/57b26cc76b8f5b7524bf9ed2/t/57f9725d725e25a7b5dd12fe/1475965533625/Remover-PG-Process.pdf Columbia University Remover PG Process]

Revision as of 04:43, 2 November 2019

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Sample Cleaning Resources

Solvent Cleans

Etching Cleans

RCA-1

Recipe steps or links

https://en.wikipedia.org/wiki/RCA_clean

Piranha Etch

HF Dip

Plasma Cleans

Wet Etching Resources

Research Papers and Books

External Laboratories

also find alternative:

Commercial Materials

KNI Wet Etch Recipes Table

Table of Wet Etch recipes from KNI Papers

And general table from you, not from papers, maybe from recipes?

Material Etchant Rate (nm/min) Anisotropy Selective to Selectivity Origin and Notes
KNI CHA Al Al Etch Type D ~1000 Highly Al High Matches Transene's expected rate
KNI PECVD SiO2 HF ~1000 Highly SiO2 High measured 10/19
KNI PECVD SiN3 Ex ~1000 Highly SiN3 High measured 10/19
KNI PECVD a-Si KOH ~1000 Highly Si High Link to KNI member's research paper

Other Procedures

Liftoff

Electroplating

Safety Resources

Do we have materials to link to?

https://cleanroom.byu.edu/acid_safety

https://cleanroom.byu.edu/HF_safety

https://cleanroom.byu.edu/solvent_safety