Difference between revisions of "Wet Chemistry Resources"

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==Solvent Cleans==
==Solvent Cleans==


*'''Acetone, IPA'''
*'''Acetone, IPA''' -Acetone serves as a solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
**Solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
*'''Acetone, Methanol''' -Similar to above except Methanol is more toxic, and a polar chemical versus IPA which is non-polar
*'''Acetone, Methanol'''
*'''Acetone, Methanol, IPA'''
**Similar to above except Methanol is more toxic, and a polar chemical versus IPA which is non-polar
*'''Acetone, Methanol, IPA, DI Water'''
*Acetone, Methanol, IPA
*'''Remover PG (50°C), IPA'''
*Acetone, Methanol, IPA, DI Water
*'''Dichloromethane, IPA''' -Caution, high evaporation rate may leave residue and beakers get quickly condense water/ice
*Remover PG (50°C), IPA
*'''Nanostrip?'''
*'''Dichloromethane, IPA'''
**Caution, high evaporation rate may leave residue and beakers get quickly condense water/ice
*Nanostrip?


==Etching Cleans==
==Etching Cleans==

Revision as of 11:45, 1 November 2019

Template:NOINDEX

Sample Cleaning Resources

Solvent Cleans

  • Acetone, IPA -Acetone serves as a solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
  • Acetone, Methanol -Similar to above except Methanol is more toxic, and a polar chemical versus IPA which is non-polar
  • Acetone, Methanol, IPA
  • Acetone, Methanol, IPA, DI Water
  • Remover PG (50°C), IPA
  • Dichloromethane, IPA -Caution, high evaporation rate may leave residue and beakers get quickly condense water/ice
  • Nanostrip?

Etching Cleans

RCA-1

Recipe steps or links

https://en.wikipedia.org/wiki/RCA_clean

Piranha Etch

HF Dip

Plasma Cleans

Wet Etching Resources

find etch list book and other links

Research Papers and Books

External Laboratories

also find alternative:

Commercial Materials


KNI Wet Etch Recipes Table

Table of Wet Etch recipes from KNI Papers

And general table from you, not from papers, maybe from recipes?

Material Etchant Rate (nm/min) Anisotropy Selective to Selectivity Origin and Notes
KNI CHA Al Al Etch Type D ~1000 Highly Al High Matches Transene's expected rate
KNI PECVD SiO2 HF ~1000 Highly SiO2 High measured 10/19
KNI PECVD SiN3 Ex ~1000 Highly SiN3 High measured 10/19
KNI PECVD a-Si KOH ~1000 Highly Si High Link to KNI member's research paper

Other Procedures

Liftoff

Electroplating

Safety Resources

Do we have materials to link to?

https://cleanroom.byu.edu/acid_safety

https://cleanroom.byu.edu/HF_safety

https://cleanroom.byu.edu/solvent_safety