Difference between revisions of "Wet Chemistry Resources"

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==Solvent Cleans==
==Solvent Cleans==
*'''Acetone, IPA'''
**Solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
*'''Acetone, Methanol'''
**Similar to above except Methanol is more toxic, and a polar chemical versus IPA which is non-polar
*Acetone, Methanol, IPA
*Remover PG (50°C), IPA
*'''Dichloromethane, IPA'''
**Caution, high evaporation rate may leave residue and beakers get quickly condense water/ice
*Nanostrip?


==Etching Cleans==
==Etching Cleans==

Revision as of 09:15, 31 October 2019

Template:NOINDEX

cleaning procedures links, breakout

Sample Cleaning Resources

https://cleanroom.byu.edu/clean

Solvent Cleans

  • Acetone, IPA
    • Solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
  • Acetone, Methanol
    • Similar to above except Methanol is more toxic, and a polar chemical versus IPA which is non-polar
  • Acetone, Methanol, IPA
  • Remover PG (50°C), IPA
  • Dichloromethane, IPA
    • Caution, high evaporation rate may leave residue and beakers get quickly condense water/ice
  • Nanostrip?

Etching Cleans

RCA-1

Piranha Etch

HF Dip

Plasma Cleans

Wet Etching Resources

BYU Etch list https://cleanroom.byu.edu/wet_etch

find etch list book and other links http://transene.com/etch-compatibility/

Etch rates for micromachining processing http://ieeexplore.ieee.org/abstract/document/546406/

Etch rates for micromachining processing-Part II https://ieeexplore.ieee.org/document/1257354

UMich wet etch info http://lnf-wiki.eecs.umich.edu/wiki/Wet_etching

BYU Transene Wet Etch https://transene.com/etchants/

KOH, also find alternative: https://cleanroom.byu.edu/KOH

BYU etching guidance: https://cleanroom.byu.edu/chemical_etching.html

KNI Wet Etch Recipes Table

Table of Wet Etch recipes from KNI Papers

And general table from you, not from papers, maybe from recipes?

Material Etchant Rate (nm/min) Anisotropy Selective to Selectivity Origin and Notes
KNI CHA Al Al Etch Type D ~1000 Highly Al High Transene
KNI PECVD SiO2 HF ~1000 Highly SiO2 High measured 10/19
KNI PECVD SiN3 Ex ~1000 Highly SiN3 High measured 10/19
KNI PECVD a-Si KOH ~1000 Highly Si High measured 10/19

Other Procedures

Liftoff

UCSB liftoff guidance: https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Lift-Off_Techniques

Electroplating

Electroplating materials supplier: https://www.technic.com/chemistry

Safety Resources

https://cleanroom.byu.edu/acid_safety

https://cleanroom.byu.edu/HF_safety

https://cleanroom.byu.edu/solvent_safety