Difference between revisions of "Wet Chemistry Resources"
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==Solvent Cleans== | ==Solvent Cleans== | ||
*'''Acetone, IPA''' | |||
**Solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate | |||
*'''Acetone, Methanol''' | |||
**Similar to above except Methanol is more toxic, and a polar chemical versus IPA which is non-polar | |||
*Acetone, Methanol, IPA | |||
*Remover PG (50°C), IPA | |||
*'''Dichloromethane, IPA''' | |||
**Caution, high evaporation rate may leave residue and beakers get quickly condense water/ice | |||
*Nanostrip? | |||
==Etching Cleans== | ==Etching Cleans== |
Revision as of 09:15, 31 October 2019
cleaning procedures links, breakout
Sample Cleaning Resources
https://cleanroom.byu.edu/clean
Solvent Cleans
- Acetone, IPA
- Solvent for organics, IPA cleans remaining residues due to acetone's high evaporation rate
- Acetone, Methanol
- Similar to above except Methanol is more toxic, and a polar chemical versus IPA which is non-polar
- Acetone, Methanol, IPA
- Remover PG (50°C), IPA
- Dichloromethane, IPA
- Caution, high evaporation rate may leave residue and beakers get quickly condense water/ice
- Nanostrip?
Etching Cleans
RCA-1
Piranha Etch
HF Dip
Plasma Cleans
Wet Etching Resources
BYU Etch list https://cleanroom.byu.edu/wet_etch
find etch list book and other links http://transene.com/etch-compatibility/
Etch rates for micromachining processing http://ieeexplore.ieee.org/abstract/document/546406/
Etch rates for micromachining processing-Part II https://ieeexplore.ieee.org/document/1257354
UMich wet etch info http://lnf-wiki.eecs.umich.edu/wiki/Wet_etching
BYU Transene Wet Etch https://transene.com/etchants/
KOH, also find alternative: https://cleanroom.byu.edu/KOH
BYU etching guidance: https://cleanroom.byu.edu/chemical_etching.html
KNI Wet Etch Recipes Table
Table of Wet Etch recipes from KNI Papers
And general table from you, not from papers, maybe from recipes?
Material | Etchant | Rate (nm/min) | Anisotropy | Selective to | Selectivity | Origin and Notes |
---|---|---|---|---|---|---|
KNI CHA Al | Al Etch Type D | ~1000 | Highly | Al | High | Transene |
KNI PECVD SiO2 | HF | ~1000 | Highly | SiO2 | High | measured 10/19 |
KNI PECVD SiN3 | Ex | ~1000 | Highly | SiN3 | High | measured 10/19 |
KNI PECVD a-Si | KOH | ~1000 | Highly | Si | High | measured 10/19 |
Other Procedures
Liftoff
UCSB liftoff guidance: https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Lift-Off_Techniques
Electroplating
Electroplating materials supplier: https://www.technic.com/chemistry
Safety Resources
https://cleanroom.byu.edu/acid_safety