Difference between revisions of "Wet Chemistry"

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Line 54: Line 54:
* PG Remover
* PG Remover
* PGMEA
* PGMEA
* Phosphoric Acid (H<sub>s</sub>PO<sub>4</sub>)
* Phosphoric Acid (H<sub>3</sub>PO<sub>4</sub>)
* Potassium Hydroxide (KOH)
* Potassium Hydroxide (KOH)
* SU-8 Developer
* SU-8 Developer

Revision as of 22:05, 26 May 2019

Wet Chemistry
Wet-Chemistry Solvents-and-HF.jpg
Instrument Type Wet Chemistry
Techniques Wet Chemical Processing:
Acids, Bases, Solvents,
and Electroplating
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Sign up for Chemistry email list
Lab Location B211 Steele
Lab Phone 626-395-1538
Manufacturer NA
Model NA

Description

Available Benches
  • Acids
  • Hydrofluoric Acid (HF)
  • Bases
  • Potassium Hydroxide (KOH)
  • Solvents
  • Electroplating
Chemicals Provided by the KNI
  • Acetic Acid, Glacial
  • Acetone
  • Aluminum Etchant A
  • Alumnium Etchant D
  • Ammonium Hydroxide BDH chemicals (NH4OH)
  • Ammonium Hydroxide JT Baker
  • Au Etchant
  • AZ 400 Photoresist Developer
  • AZ 726 Photoresist Developer
  • AZ4620
  • AZ 5214 E IR
  • Buffered Hydrofluoric Acid (BHF)
  • CD-26
  • Chrome Etchant
  • Citric Acid
  • Copper Etchant
  • Hexamethyldisilazane (HMDS)
  • Hydrochloric Acid (HCl)
  • Hydrofluoric Acid (HF)
  • Hydrogen Peroxide (H2O2)
  • Isopropyl Alchohol (IPA)
  • Methanol
  • Methyl Iso Butyl Ketone (MIBK)
  • Methylene Chloride (Dichloromethane)
  • MF 319
  • Nanostrip
  • Nanostrip 2x
  • PG Remover
  • PGMEA
  • Phosphoric Acid (H3PO4)
  • Potassium Hydroxide (KOH)
  • SU-8 Developer
  • Sulfuric Acid (H2SO4)
  • Titanium Etchant
  • Tetramethylammonium Hydroxide (TMAH)
Approved Chemicals

Resources

Material Safety Data Sheets (MSDS)