Wet Chemistry: Difference between revisions
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| Line 54: | Line 54: | ||
* PG Remover | * PG Remover | ||
* PGMEA | * PGMEA | ||
* Phosphoric Acid (H<sub> | * Phosphoric Acid (H<sub>3</sub>PO<sub>4</sub>) | ||
* Potassium Hydroxide (KOH) | * Potassium Hydroxide (KOH) | ||
* SU-8 Developer | * SU-8 Developer | ||
Revision as of 22:05, 26 May 2019
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Description
Available Benches
- Acids
- Hydrofluoric Acid (HF)
- Bases
- Potassium Hydroxide (KOH)
- Solvents
- Electroplating
Chemicals Provided by the KNI
- Acetic Acid, Glacial
- Acetone
- Aluminum Etchant A
- Alumnium Etchant D
- Ammonium Hydroxide BDH chemicals (NH4OH)
- Ammonium Hydroxide JT Baker
- Au Etchant
- AZ 400 Photoresist Developer
- AZ 726 Photoresist Developer
- AZ4620
- AZ 5214 E IR
- Buffered Hydrofluoric Acid (BHF)
- CD-26
- Chrome Etchant
- Citric Acid
- Copper Etchant
- Hexamethyldisilazane (HMDS)
- Hydrochloric Acid (HCl)
- Hydrofluoric Acid (HF)
- Hydrogen Peroxide (H2O2)
- Isopropyl Alchohol (IPA)
- Methanol
- Methyl Iso Butyl Ketone (MIBK)
- Methylene Chloride (Dichloromethane)
- MF 319
- Nanostrip
- Nanostrip 2x
- PG Remover
- PGMEA
- Phosphoric Acid (H3PO4)
- Potassium Hydroxide (KOH)
- SU-8 Developer
- Sulfuric Acid (H2SO4)
- Titanium Etchant
- Tetramethylammonium Hydroxide (TMAH)