Difference between revisions of "Wet Chemistry"

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* Electroplating
* Electroplating
===== Chemicals Provided by the KNI =====
===== Chemicals Provided by the KNI =====
* Methylene Chloride = Dichloromethane
* Acetic Acid, Glacial
* HMDS = Hexamethyldisilazane
* IPA= Isopropyl Alchohol
* Acetone
* Acetone
* KOH = Potassium Hydroxide
* Aluminum etchant A
* MIBK (new product)=Methyl Iso Butyl Ketone
* Alumnium etchant D
* MIBK (backup product)
* Ammonium Hydroxide BDH chemicals (NH4OH)
* H2O2=Hydrogen Peroxide
* H2SO4=Sulfuric Acid
* HCl=Hydrochloric Acid
* H3PO4=Phosphoric Acid
* Methanol
* NH4OH=Ammonium Hydroxide BDH chemicals
* Ammonium Hydroxide JT Baker
* Ammonium Hydroxide JT Baker
* HF=Hydrofluoric Acid
* Acetic Acid, Glacial
* Al etchant A
* Al etchant D
* Au Etchant
* Au Etchant
* AZ 400 Photoresist Developer
* AZ 400 Photoresist Developer
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* AZ4620
* AZ4620
* AZ 5214 E IR
* AZ 5214 E IR
* BOE=BHF=Buffered HF
* Buffered Hydrofluoric Acid (BHF)
* CD-26
* CD-26
* Chrome etch
* Chrome Etchant
* Citric Acid
* Citric Acid
* Cu Etchant
* Copper Etchant
* Hexamethyldisilazane (HMDS)
* Hydrochloric Acid (HCl)
* Hydrofluoric Acid (HF)
* Hydrogen Peroxide (H<sub>2</sub>O<sub>2</sub>)
* Isopropyl Alchohol (IPA)
* Methanol
* Methyl Iso Butyl Ketone (MIBK)
* Methylene Chloride (Dichloromethane)
* MF 319
* MF 319
* Nanostrip
* Nanostrip
* Nanostrip 2x
* Nanostrip 2x
* PG Remover
* PG Remover
* PGMEA
* Phosphoric Acid (H3PO4)
* Potassium Hydroxide (KOH)
* SU-8 Developer
* Sulfuric Acid (H2SO4)
* Ti etchant
* Ti etchant
* Ti etchant
* TetraMethylAmmoniumHydroxide (TMAH)
* TMAH=TetraMethylAmmoniumHydroxide
 
* SU-8 Developer
* PGMEA
===== Approved Chemicals =====
===== Approved Chemicals =====
* [[Material Safety Data Sheets (MSDS)#Liquids | See List]]
* [[Material Safety Data Sheets (MSDS)#Liquids | See List]]

Revision as of 22:03, 26 May 2019

Wet Chemistry
Wet-Chemistry Solvents-and-HF.jpg
Instrument Type Wet Chemistry
Techniques Wet Chemical Processing:
Acids, Bases, Solvents,
and Electroplating
Staff Manager Bert Mendoza
Staff Email bertm@caltech.edu
Staff Phone 626-395-4075
Reserve time on LabRunr
Request training by email
Sign up for Chemistry email list
Lab Location B211 Steele
Lab Phone 626-395-1538
Manufacturer NA
Model NA

Description

Available Benches
  • Acids
  • Hydrofluoric Acid (HF)
  • Bases
  • Potassium Hydroxide (KOH)
  • Solvents
  • Electroplating
Chemicals Provided by the KNI
  • Acetic Acid, Glacial
  • Acetone
  • Aluminum etchant A
  • Alumnium etchant D
  • Ammonium Hydroxide BDH chemicals (NH4OH)
  • Ammonium Hydroxide JT Baker
  • Au Etchant
  • AZ 400 Photoresist Developer
  • AZ 726 Photoresist Developer
  • AZ4620
  • AZ 5214 E IR
  • Buffered Hydrofluoric Acid (BHF)
  • CD-26
  • Chrome Etchant
  • Citric Acid
  • Copper Etchant
  • Hexamethyldisilazane (HMDS)
  • Hydrochloric Acid (HCl)
  • Hydrofluoric Acid (HF)
  • Hydrogen Peroxide (H2O2)
  • Isopropyl Alchohol (IPA)
  • Methanol
  • Methyl Iso Butyl Ketone (MIBK)
  • Methylene Chloride (Dichloromethane)
  • MF 319
  • Nanostrip
  • Nanostrip 2x
  • PG Remover
  • PGMEA
  • Phosphoric Acid (H3PO4)
  • Potassium Hydroxide (KOH)
  • SU-8 Developer
  • Sulfuric Acid (H2SO4)
  • Ti etchant
  • TetraMethylAmmoniumHydroxide (TMAH)
Approved Chemicals

Resources

Material Safety Data Sheets (MSDS)