Tergeo Plus ICP- & CCP-RIE: Oxygen & Argon Plasma Cleaner

Tergeo Plus Plasma Cleaner [[image:|320x373px|center|]] Instrument Type Etching, Microscopy Techniques Plasma Cleaning, Direct Mode (ICP), Remote Mode (CCP) Staff Manager Matthew S. Hunt, PhD Staff Email matthew.hunt@caltech.edu Staff Phone 626-395-5994 Reserve time on LabRunr Request training by email Lab Location B203 Steele Lab Phone 626-395-1542 Manufacturer PIE Scientific Model {{{Model}}}

Description

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Type1 Applications

• Application1
• Application2
• Application3

Type2 Applications

• Application1
• Application2
• Application3

Resources

SOPs & Troubleshooting

• SOP Type (Short Version | Long Version)
• KNI's SOP
• Other SOP1
• Other SOP2
• Troubleshooting Guide

Video Tutorials

• Video 1 | Video 2
• Video Series: (Part 1 | Part 2 | Part 3)

Graphical Handouts

• Handout 1
• Handout 2

Presentations

• Presentation 1
• Presentation 2

Manufacturer Manuals

• Manual 1
• Manual 2

Specifications

Manufacturer Specifications

• Manufacturuer Data Sheet

Mode 1 Specifications

• Voltage Range: 0.5 to 30.0 kV
• Aperture Sizes: 10 mm, 15 mm, 20 mmm, 30 mm
• etc.

Mode 2 Specifications

• Voltage Range: 5.0 to 30.0 kV
• Current Range: 10 pA - 20 nA
• etc.