TEM Sample Preparation Equipment: Difference between revisions
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== List of Equipment Available == | == List of Equipment Available == | ||
[[Image:Dimpler-and-Disk-Cuttter.jpg|thumb|top|upright=1.0|The Dimpler and 3 mm Disk Cutter]] | [[Image:Dimpler-and-Disk-Cuttter.jpg|thumb|top|upright=1.0|The Dimpler and 3 mm Disk Cutter]] | ||
[[Image:Polishing-Station-Allied-TechPrep.jpg|thumb|top|upright=1.0|The polishing station with automated handling and control]] | [[Image:Polishing-Station-Allied-TechPrep.jpg|thumb|top|upright=1.0|The polishing station with automated handling of the polishing jig and control of its sweeping motion]] | ||
* Low-Angle Argon Milling & Polishing Station: Fischione Model 1010 (shown in infobox image) | * Low-Angle Argon Milling & Polishing Station: Fischione Model 1010 (shown in infobox image) | ||
* Dimpler: Fischione Model 2000 | * Dimpler: Fischione Model 2000 | ||
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** Media: grit paper, lapping films, polishing cloths, diamond suspensions, alumina poweders | ** Media: grit paper, lapping films, polishing cloths, diamond suspensions, alumina poweders | ||
** Accessories: tripod polisher (South Bay Technology), endpoint polisher (Fischione Model 160) | ** Accessories: tripod polisher (South Bay Technology), endpoint polisher (Fischione Model 160) | ||
== Resources == | == Resources == | ||
===== SOPs ===== | ===== SOPs ===== |
Revision as of 01:01, 7 May 2019
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Description
The KNI offers a lab in the Keck sub-basement for preparing TEM samples by traditional means, often to produce cross-section specimens from a bulk sample. This typically involves the following steps:
- Glue together a stack of materials, e.g. with the surface of two samples facing each other
(if the surface is what you want to observe in the TEM) - Cut the stack into thin slices of material, in the appropriate orientation
(the thin dimension here will be the same thin dimension in the TEM) - Cut out a 3 mm circle from this thin slice using a Disk Cutter
- Polish that thin disk down to a thickness of ~100 μm
- Use a Dimpler to polish a hemispherical dimple into the middle of the disk,
such that only a few microns of material remain at the thinnest portion - Use an Argon Mill to perform the final polish of the thinnest portion,
until a hole has been bored through the middle and
the edges of that hole are thin enough to be electron-transparent in the TEM
List of Equipment Available
- Low-Angle Argon Milling & Polishing Station: Fischione Model 1010 (shown in infobox image)
- Dimpler: Fischione Model 2000
- Ultrasonic Disk Cutter: Model 170
- Polishing Station: Allied TechPrep
- Polishing Station: Buehler Ecomet 3
- Low Speed Saw: Isomet
- Roll Grinder: Buehler Handimet 2
- Various polishing media & accessories:
- Media: grit paper, lapping films, polishing cloths, diamond suspensions, alumina poweders
- Accessories: tripod polisher (South Bay Technology), endpoint polisher (Fischione Model 160)
Resources
SOPs
- Paper copies of SOPs are available in the lab for the Argon Ion Mill & Dimpler